H05K 13/0215
Interconnecting of containers
Official title: {Interconnecting of containers, e.g. splicing of tapes}
H05K13/0215 (Interconnecting of containers) appears on 83 US grants and 77 published applications in this corpus.
Search patents in H05K- Granted patents
- 83
- Published applications
- 77
- Assignees
- 34
- Inventors
- 121
- Latest grant
- 23 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 2 |
| 2003 | 0 | 1 |
| 2004 | 3 | 5 |
| 2005 | 5 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 4 |
| 2008 | 0 | 1 |
| 2009 | 2 | 1 |
| 2010 | 2 | 3 |
| 2011 | 0 | 1 |
| 2012 | 4 | 3 |
| 2013 | 1 | 3 |
| 2014 | 3 | 0 |
| 2015 | 3 | 10 |
| 2016 | 4 | 4 |
| 2017 | 8 | 3 |
| 2018 | 2 | 14 |
| 2019 | 7 | 7 |
| 2020 | 12 | 6 |
| 2021 | 3 | 3 |
| 2022 | 5 | 1 |
| 2023 | 5 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Deposit device23 Dec 2025US 12,507,388 B2Henan Fuchi Technology Co., Ltd.
- Electronic component package, electronic component series, and electronic component series forming apparatus24 Dec 2024US 12,177,984 B2Murata Manufacturing Co., Ltd.
- Tape auto-loading device and tape linking method therefor26 Dec 2023US 11,856,704 B2Fuji Corporation
- Feeder management device and component-mounting system provided with same28 Mar 2023US 11,617,288 B2Yamaha Hatsudoki Kabushiki Kaisha
- Component supply device and surface mounting machine14 Mar 2023US 11,606,891 B2Yamaha Hatsudoki Kabushiki Kaisha
- Component mounting machine and maintenance method30 Apr 2026US 2026/0122872 A1Fuji Corporation
- Method for Automatic Reloading of SMD Component Reels on SMD Assembly Machines9 Oct 2025US 2025/0318096 A1KUKA Deutschland GmbH
- Deposit device24 Aug 2023US 2023/0269920 A1Henan Fuchi Technology Co., Ltd.
- Circuit board tape and joining method thereof17 Mar 2022US 2022/0087017 A1Chipbond Technology Corporation
- Component supply device and tape feeder1 Jul 2021US 2021/0204457 A1Yamaha Hatsudoki Kabushiki Kaisha
Most cited
By later US patents
- Tape packaging system with removeable covers128US 5,562,384 A1996
- Automated component placement apparatus28US 5,809,639 ARobodyne Corporation · 1998
- Apparatus supplying components to a placement machine with splice sensor24US 6,157,870 AZevatech Trading AG · 2000
- Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes23US 6,694,606 B1Fuji Machine Mfg. Co., Ltd. · 2004
- Electric-component tape feeding apparatus and electric-component supplying method18US 6,082,603 AFuji Machine Mfg. Co., Ltd. · 2000