H05B 3/686
Heat-storage plates
Official title: {Heat-storage plates}
H05B3/686 (Heat-storage plates) appears on 12 US grants and 16 published applications in this corpus.
Search patents in H05B- Granted patents
- 12
- Published applications
- 16
- Assignees
- 7
- Inventors
- 13
- Latest grant
- 1 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 6 |
| 2016 | 0 | 1 |
| 2017 | 2 | 0 |
| 2018 | 3 | 2 |
| 2019 | 2 | 2 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Using cumulative heat amount data to qualify hot plate used for post-exposure baking1 Jul 2025US 12,347,682 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Using cumulative heat amount data to qualify hot plate used for postexposure baking13 Aug 2024US 12,062,542 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Using cumulative heat amount data to qualify hot plate used for postexposure baking11 Jan 2022US 11,222,783 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Hot and cold shelf assembly with replaceable heating elements14 May 2019US 10,288,361 B2Hatco Corporation
- Method for entropy-encoding slice segment and apparatus therefor, and method for entropy-decoding slice segment and apparatus therefor23 Apr 2019US 10,271,071 B2Samsung Electronics Co., Ltd.
- Using cumulative heat amount data to qualify hot plate used for post-exposure baking7 Nov 2024US 2024/0371639 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Stackable, rechargeable dish warming system and assembly21 Jul 2022US 2022/0225829 A1
- Using Cumulative Heat Amount Data To Qualify Hot Plate Used For Postexposure Baking5 May 2022US 2022/0139698 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hot and cold shelf assembly with replaceable heating elements30 May 2019US 2019/0162485 A1Hatco Corporation
- Using cumulative heat amount data to qualify hot plate used for postexposure baking21 Mar 2019US 2019/0088471 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Multipurpose pan12US 6,097,004 A2000
- Hot and cold shelf assembly with replaceable heating elements4US 10,288,361 B2Hatco Corporation · 2019
- Method for entropy-encoding slice segment and apparatus therefor, and method for entropy-decoding slice segment and apparatus therefor1US 9,866,874 B2Samsung Electronics Co., Ltd. · 2018
- Method for entropy-encoding slice segment and apparatus therefor, and method for entropy-decoding slice segment and apparatus therefor1US 9,877,049 B2Samsung Electronics Co., Ltd. · 2018