H03F 2203/45552

The ic comprising clamping means

Official title: the IC comprising clamping means, e.g. diodes

H03F2203/45552 (The ic comprising clamping means) appears on 38 US grants and 30 published applications in this corpus.

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Granted patents
38
Published applications
30
Assignees
33
Inventors
55
Latest grant
20 Sep 2022

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H03F 2203/45552: granted patents and published applications per publication year
YearGranted patentsPublished applications
198010
198100
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198300
198410
198500
198600
198710
198800
198900
199000
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199530
199620
199710
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200410
200501
200612
200713
200820
200912
201011
201112
201212
201312
201410
201545
201630
201721
201810
201913
202043
202121
202210
202300
202400
202501

By publication year. Applications have been published since 2001.