H01R 4/024
Comprising preapplied solder
Official title: {comprising preapplied solder}
H01R4/024 (Comprising preapplied solder) appears on 133 US grants and 123 published applications in this corpus.
Search patents in H01R- Granted patents
- 133
- Published applications
- 123
- Assignees
- 101
- Inventors
- 264
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 4 | 3 |
| 2002 | 10 | 10 |
| 2003 | 9 | 6 |
| 2004 | 4 | 7 |
| 2005 | 6 | 6 |
| 2006 | 3 | 3 |
| 2007 | 3 | 1 |
| 2008 | 2 | 4 |
| 2009 | 1 | 3 |
| 2010 | 3 | 1 |
| 2011 | 3 | 4 |
| 2012 | 2 | 2 |
| 2013 | 2 | 1 |
| 2014 | 4 | 2 |
| 2015 | 5 | 8 |
| 2016 | 2 | 5 |
| 2017 | 5 | 6 |
| 2018 | 6 | 6 |
| 2019 | 9 | 10 |
| 2020 | 11 | 6 |
| 2021 | 6 | 7 |
| 2022 | 3 | 5 |
| 2023 | 3 | 5 |
| 2024 | 4 | 4 |
| 2025 | 6 | 0 |
| 2026 | 2 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Cable connection structure and method for manufacturing cable connection structure25 Aug 2026US 12,718,971 B2Proterial, Ltd.
- Resistive heating wire termination system14 Jul 2026US 12,678,876 B2Onanon, Inc.
- Robotic wire termination system9 Dec 2025US 12,491,587 B2Onanon, Inc.
- Method of bonding operation wire and medical equipment9 Dec 2025US 12,494,612 B2Olympus Corporation
- Method and apparatus for creating downhole electrical connections14 Oct 2025US 12,444,878 B2Saudi Arabian Oil Company
- Method of attaching electrical connections to printed circuit boards10 Sep 2026US 2026/0269550 A1
- Self-centering electrical contacts2 Jul 2026US 2026/0188932 A1Raytheon Company
- Robotic Wire Termination System9 Apr 2026US 2026/0097456 A1Onanon, Inc.
- Method of manufacturing connector2 Apr 2026US 2026/0095009 A1Sumitomo Electric Industries, Ltd.
- Tin-based solder paste, soldering method and electronic component using same19 Mar 2026US 2026/0081363 A1Cyntec Co., Ltd.
Most cited
By later US patents
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Electrical solder ball contact51US 6,641,410 B2Teradyne, Inc. · 2003
- Coaxial connector for soldering to semirigid cable40US 5,232,377 AAMP Incorporated · 1993
- Solder-on connector for coaxial cable40US 6,439,924 B1Corning Gilbert Inc. · 2002
- Method of and structure for connecting electric wire and connecting terminal37US 6,334,798 B12002