H01R 3/08
Electrically-conductive connections not otherwise provided for: for making connection to a liquid
Official title: for making connection to a liquid {(slip rings with liquid contacts H01R39/30, H01R39/646)}
H01R3/08 (Electrically-conductive connections not otherwise provided for: for making connection to a liquid) appears on 38 US grants and 34 published applications in this corpus.
Search patents in H01R- Granted patents
- 38
- Published applications
- 34
- Assignees
- 34
- Inventors
- 136
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 2 |
| 2013 | 2 | 4 |
| 2014 | 0 | 1 |
| 2015 | 2 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 3 |
| 2018 | 1 | 4 |
| 2019 | 5 | 3 |
| 2020 | 3 | 1 |
| 2021 | 2 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 4 |
| 2024 | 0 | 2 |
| 2025 | 2 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fluidic wire connectors23 Jun 2026US 12,665,322 B2Teveri LLC
- High-velocity air-fuel coatings for conductor corrosion resistance30 Sep 2025US 12,431,260 B2Caterpillar Inc.
- Electrical connecting apparatus4 Mar 2025US 12,244,083 B2Kabushiki Kaisha Nihon Micronics
- Fluidic wire connectors20 Dec 2022US 11,532,899 B2Teveri LLC
- Downhole wet connection systems2 Mar 2021US 10,934,785 B2Halliburton Energy Services.Inc.
- Liquid metal socket interconnects with pooled wells2 Oct 2025US 2025/0309091 A1Intel Corporation
- Liquid metal socket interconnects with lithographically defined socket contact pins2 Oct 2025US 2025/0309571 A1Intel Corporation
- Ground Connection Apparatus26 Jun 2025US 2025/0210885 A1Illinois Tool Works Inc.
- Liquid metal patch interconnect for large warpage components21 Nov 2024US 2024/0388018 A1Intel Corporation
- High-velocity air-fuel coatings for conductor corrosion resistance28 Mar 2024US 2024/0105356 A1Caterpillar Inc.
Most cited
By later US patents
- Surgical instrument with electrical contact under membrane611US 10,631,860 B2Ethicon, Inc. · 2020
- Single or limited use device designs222US 8,968,294 B2Covidien LP · 2015
- Electrical connector having electrically conductive elastomer covered by insulating elastomer28US 5,174,765 ABarvid Technology Inc. · 1992
- Electrical joint compound22US 4,214,121 A1980
- Connector employing liquid conductor for electrical contact18US 5,779,492 AFujitsu Limited · 1998