Liquid metal patch interconnect for large warpage components
AssigneeIntel Corporation
InventorsKarumbu MEYYAPPAN, Gregorio R. MURTAGIAN, Ziyin LIN
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Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.
Claims20
An electronic package, comprising:
- a package substrate with a first surface and a second surface opposite from the first surface;
- a pad on the first surface of the package substrate, wherein the pad has a first width;
- a layer on the first surface of the package substrate, wherein the layer comprises a well through the layer, wherein the well has a second width that is wider than the first width;
- and
- a metallic material in the well and in contact with the pad, the metallic material comprising gallium.
An electronic package, comprising:
- a first substrate with a first pad;
- a second substrate with a second pad;
- a layer between the first substrate and the second substrate, wherein the layer comprises a well through the layer;
- and
- a liquid metal in the well, wherein the liquid metal contacts the first pad and the second pad.
An electronic system, comprising:
- a board with a first pad;
- a package substrate with a second pad electrically coupled to the board by a liquid metal that contacts the first pad and the second pad;
- and
- a die coupled to the package substrate.
Dependencies are inferred from the claim text.