H01R 12/523
By an interconnection through aligned holes in the boards or multilayer board
Official title: {by an interconnection through aligned holes in the boards or multilayer board}
H01R12/523 (By an interconnection through aligned holes in the boards or multilayer board) appears on 417 US grants and 297 published applications in this corpus.
Search patents in H01R- Granted patents
- 417
- Published applications
- 297
- Assignees
- 260
- Inventors
- 799
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 6 | 0 |
| 1990 | 7 | 0 |
| 1991 | 9 | 0 |
| 1992 | 9 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 11 | 0 |
| 1997 | 8 | 0 |
| 1998 | 10 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 21 | 7 |
| 2002 | 9 | 12 |
| 2003 | 13 | 7 |
| 2004 | 20 | 17 |
| 2005 | 13 | 19 |
| 2006 | 18 | 14 |
| 2007 | 9 | 22 |
| 2008 | 16 | 12 |
| 2009 | 7 | 14 |
| 2010 | 12 | 10 |
| 2011 | 13 | 5 |
| 2012 | 5 | 8 |
| 2013 | 6 | 8 |
| 2014 | 5 | 11 |
| 2015 | 13 | 13 |
| 2016 | 16 | 6 |
| 2017 | 13 | 8 |
| 2018 | 8 | 5 |
| 2019 | 6 | 12 |
| 2020 | 11 | 19 |
| 2021 | 18 | 19 |
| 2022 | 16 | 18 |
| 2023 | 9 | 10 |
| 2024 | 9 | 11 |
| 2025 | 13 | 8 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bridging connector, connection assembly, vehicle lamp, and vehicle23 Jun 2026US 12,665,364 B2Valeo Vision
- Power module comprising positioning structures, alignment tool and method for positioning and aligning the power module5 May 2026US 12,620,730 B2Hitachi Energy Ltd
- Electronic component module14 Apr 2026US 12,604,421 B2Toyota Jidosha Kabushiki Kaisha
- LED electrical contact for 3D LEDs14 Apr 2026US 12,604,772 B2Lumileds Singapore Pte. Ltd.
- Interconnect substrate including substrates and connector disposed in recess21 Oct 2025US 12,451,631 B2Shinko Electric Industries Co., Ltd.
- Test access port expander27 Aug 2026US 2026/0254138 A1Schweitzer Engineering Laboratories, Inc.
- Press-fit connector with modular components11 Jun 2026US 2026/0163293 A1Ennovi Industries, Inc.
- Connection designs for memory systems9 Oct 2025US 2025/0316915 A1Micron Technology, Inc.
- Mechanical snap locking7 Aug 2025US 2025/0254797 A1Honeywell International Inc.
- Printed circuit board assembly with snap interface for electrical connection17 Jul 2025US 2025/0233330 A1Webasto Charging Systems, Inc.
Most cited
By later US patents
- Stackable module291US 6,731,514 B2STMicroelectronics S.r.l. · 2004
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- Stackable modules and multimodular assemblies175US 5,701,233 AIrvine Sensors Corporation · 1997
- Method of stacking printed circuit boards158US 4,733,461 AMicro Co., Ltd. · 1988
- Multi-layer circuit construction methods with customization features158US 5,282,312 ATessera, Inc. · 1994