US 5,701,233 A · Stackable modules and multimodular assemblies

Abstract

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or "tub" of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules. The connector arrays can also serve to seal the assembly when the entire assemblage of modules is compressed and to connect the stacked modular assembly to exterior circuitry such as a printed circuit board or other device. Methods are also provided for assembling and electrically interconnecting electronic components within such stacked multimodular assemblies by attaching components of an electronic circuit to at least two stackable modules of the type described within the cavity thereof, interconnecting the circuit components with the described through-vias, and stacking and interconnecting the stackable modules with the described multichannel connector arrays interposed between each adjacent module pair.

Claims24

Dependent claims

A stacked, resealable, multimodular, electronic circuit assembly comprising:

(1) at least two stacked modules, each module comprising a dielectric substrate having upper and lower planar surfaces and at least one cavity in at least one of said surfaces said cavity having lesser width and breadth than said one surface, thereby forming a dielectric substrate matrix surround said cavity;
(2) at least one electronic component comprising a three-dimensional stack of IC chips positioned within at least one cavity of each of the said modules and having I/O contacts;
(3) a closure plate overlying said cavity, enclosing same and bonded to said one surface to provide a hermetic seal of said cavity;
(4) a plurality of electrically conductive through-vias between said upper and lower planar surfaces of each of said modules outside of said cavity and within said matrix, each of said through-vias having exposed electric contact points where it penetrates said upper and lower planar surfaces;
(5) said I/O contacts of said electronic components in each of said modules being electrically connected with through-vias in each respective module;
and
(6) a planar, multichannel connector between each opposing pair of said modules for sealing said modules when pressed together and having separate electrically conductive through channels in an array on centers of 0.2 inch or less and electrically coupling opposing through-vias in said adjacent modules.

4 more elements

A stacked, resealable, multimodular, electronic circuit assembly comprising:

(1) at least two stacked modules, each module comprising a dielectric substrate formed of multiple, dielectric lamina having upper and lower planar surfaces forming interfaces between adjacent lamina, and at least one cavity in at least one of said surfaces, said cavity having lesser width and breadth than said one surface, thereby forming a dielectric substrate matrix surrounding said cavity;
(2) a plurality of electrically conductive through-vias oriented along axes generally perpendicular to the planar surfaces of said lamina and arrayed in at least two rows of said through-vias bordering at least one side of said cavities in said modules, and the number of interfaces between said layers in at least one of said modules is at least equal to the number of said rows of said through-vias between said upper and lower planar surfaces of each of said modules outside of said cavity and within said matrix, each of said through-vias having exposed electric contact points where it penetrates said upper and lower planar surfaces;
(3) at least one electronic component comprising a three-dimensional stack of IC chips positioned within at least one cavity of each of the said modules and having I/O contacts connected to said through-vias by electrically conductive paths along the interfaces between adjacent layers;
(4) a closure plate overlying said cavity, enclosing same and bonded to said one surface to provide a hermetic seal of said cavity;
(5) at least about 50 of said I/O contacts electrically connected to said through-vias, and each of said modules has at least about 50 of said through-vias electrically connected with corresponding opposing vias on adjacent modules with said I/O contacts of said electronic components in each of said modules being electrically connected with through-vias in each respective module;
(6) a planar, multichannel connector array between each opposing pair of said modules having separate electrically conductive channels electrically coupling opposing through-vias in said adjacent modules and for sealing said modules when pressed together;
and
(7) contact pads at either end of said through-vias having a diameter greater than the maximum diameter of the through-vias, with said through-vias arranged in a grid pattern on centers of about 0.2 inch or less, and each having a diameter within the module matrix of about 0.05 inch or less.

5 more elements

A stackable module for containing and interconnecting electronic components comprising a dielectric substrate having upper and lower planar surfaces and at least one cavity on at least one of said surfaces for containing one or more three-dimensional IC chip stacks, said substrate comprising multiple, laminated layers of said dielectric, at least 100 electrically conductive through-vias between said upper and lower planar surfaces of said module outside of said cavity and within the matrix of said module in a grid pattern bordering said cavity and being spaced on centers of about 0.2 inch or less and having maximum diameters within the matrix of said module of about 0.05 inch or less, each of said through-vias having exposed electric contacts at either end where it penetrates said upper and lower surfaces of said planar substrate and electrically conductive signal paths interconnecting said through-vias and the interior of said cavity and being located between said layers of said module for communicating electronic signals to and from electronic components within said cavity, and a closure plate covering said cavity and sealed thereabout to hermetically contain said cavity.

A stacked, resealable, multimodular, electronic circuit assembly comprising at least three stacked modules, each module comprising multiple laminated dielectric lamina layers of a refractory inorganic oxide forming a dielectric substrate having upper and lower planar surfaces and at least one cavity in at least one surface of each of said modules for containing at least one electronic component;

a. said laminated dielectric lamina being oriented in planes generally parallel to said upper and lower planar surfaces;
b. at least one three-dimensional chip stack of electronic components positioned within at least one cavity on each of said modules and having I/O contacts;
c. at least about 200 electrically conductive through-vias between said upper and lower planar surfaces of each of said modules through the matrix thereof outside of said cavity and within the outer surface of each module, each of said through-vias having exposed electrical contact points where it penetrates said upper and lower planar surfaces of said module, and the position of said contact points on each surface of said module corresponding to the position of corresponding through-via contact points on adjacent modules, whereby said contact points can be electrically interconnected as described hereinafter;
d. at least about 100 of said I/O contacts of said electronic components being electrically connected to said through-vias by electrically conductive paths along the interfaces between adjacent layers of said dielectric lamina;
and
e. a resealable, multichannel connector array between each opposing pair of said modules having separate electrically conductive channels electrically coupling opposing, matching through-vias in said adjacent modules and for sealing said modules when pressed together, thereby hermetically sealing each of said cavities, said multichannel connector array comprising a dielectric plastic or elastomeric layer with said electrically conductive channels in an array on centers of about 0.2 inch or less.

3 more elements

Dependencies are inferred from the claim text.

Stackable modules and multimodular assemblies

Life of this patent

Stackable modules and multimodular assemblies

Life of this patent

Abstract

Claims24