H01H 2037/046

Being soldered on the printed circuit to be protected

Official title: {being soldered on the printed circuit to be protected}

H01H2037/046 (Being soldered on the printed circuit to be protected) appears on 55 US grants and 48 published applications in this corpus.

Search patents in H01H
Granted patents
55
Published applications
48
Assignees
44
Inventors
125
Latest grant
14 May 2024

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H01H 2037/046: granted patents and published applications per publication year
YearGranted patentsPublished applications
198010
198100
198200
198300
198400
198510
198610
198700
198810
198910
199000
199100
199220
199300
199420
199500
199600
199730
199810
199930
200010
200130
200232
200310
200420
200501
200612
200711
200800
200900
201003
201100
201214
201313
201411
201526
201643
201722
201843
201935
202037
202141
202211
202301
202412

By publication year. Applications have been published since 2001.