Thermal overlaod fuse of surface mount compatible construction
AssigneeRoederstein Spezialfabriken fur Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH
InventorKurt Fischer
Life of this patent
Estimating the term…
Abstract
A thermal overload fuse (1) for fixation to a circuit substrate (17) comprising at least one spring arm (13) which is solderable, under fixed pre-stressed, to a contact location on the substrate, characterized in that the spring arm (13), which is fixed to an at least substantially planar frame part (2), adopts, in its relaxed state, a position which is spaced in a perpendicular direction relative to the substrate (17), in particular relative to the contact location (16); and in that the free end of the spring arm (13) is held down by at least one auxiliary web (7) onto the substrate (17), in particular onto the contact location (16); and in that the auxiliary web (7) is detachable from the frame part (2) along a predetermined line.
Claims13
Thermal overload fuse (1) for soldering to a circuit substrate (17) having at least one spring arm (13) which is solderable, under fixed pre-stress, to a contact location (16) of the substrate (17), characterised in that
- the spring arm (13), which is fixed to an at least substantially planar frame part (2), adopts, in its relaxed state, a position which is spaced in a perpendicular direction relative to the substrate (17), in particular relative to the contact location (16);
- and in that
- the free end of the spring arm (13) is held down by at least one auxiliary web (7) onto the substrate (17), in particular onto the contact location (16);
- and in that
- the auxiliary web (7) is detachable from the frame part (2) along a predetermined line.
Dependencies are inferred from the claim text.