US 2023/0395342 A1 · SMD TYPE TCO DEVICE

Abstract

Thermal Cut-Off (TCO) devices suitable for surface mount reflow processes are disclosed. The TCO devices are modeled after existing lead attached TCO device structures, but are improved with compact and miniaturized structures suitable for surface mount reflow operations. The arm and base terminals include pads for surface mount reflow. The base molds are designed for receiving the PTC device, bimetal device, and arm terminal feature and may operate using either a single base terminal or a multi-part base terminal. Multiple cover designs are disclosed to lower the heat capacity of the upper plate of the TCO device relative to the base terminal. A TCO device featuring an integrated arm and bimetal device terminal is also disclosed, with an updated base portion to support the integrated terminal.

Claims20

Dependent claims

A thermal cut-off (TCO) device, comprising:

a base portion comprising a base mold and a base terminal, wherein the base terminal comprises first and second pads;
a bimetal disc seated in the base portion, the bimetal disc being disposed between the base terminal and the arm terminal;
and
an arm terminal to electrically connect to the base terminal;
wherein the first and second pads are attachable to a substrate using a surface mount reflow process.

2 more elements

Dependencies are inferred from the claim text.

Smd type tco device

Life of this patent

Smd type tco device

Life of this patent

Abstract

Claims20