H01G 4/224
Housing
Official title: Housing; Encapsulation
H01G4/224 (Housing) appears on 1,190 US grants and 1,484 published applications in this corpus.
Search patents in H01G- Granted patents
- 1,190
- Published applications
- 1,484
- Assignees
- 283
- Inventors
- 2,304
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 0 |
| 2002 | 3 | 2 |
| 2003 | 1 | 3 |
| 2004 | 3 | 2 |
| 2005 | 5 | 6 |
| 2006 | 1 | 4 |
| 2007 | 3 | 7 |
| 2008 | 1 | 10 |
| 2009 | 4 | 8 |
| 2010 | 7 | 13 |
| 2011 | 9 | 10 |
| 2012 | 12 | 12 |
| 2013 | 7 | 17 |
| 2014 | 13 | 31 |
| 2015 | 18 | 39 |
| 2016 | 29 | 53 |
| 2017 | 50 | 69 |
| 2018 | 61 | 86 |
| 2019 | 86 | 103 |
| 2020 | 105 | 145 |
| 2021 | 115 | 133 |
| 2022 | 114 | 127 |
| 2023 | 124 | 181 |
| 2024 | 126 | 136 |
| 2025 | 146 | 158 |
| 2026 | 72 | 129 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Video surveillance playback system with multi-tiered storage6 Oct 2026US 12,755,902 B2Cozaint Corporation
- Multilayer ceramic electronic component including metal terminals including intermetallic compound29 Sep 2026US 12,749,624 B2Murata Manufacturing Co., Ltd.
- Film capacitor having bent lead wires and capacitor module29 Sep 2026US 12,749,625 B2LG Innotek Co., Ltd.
- Multilayer ceramic electronic component including metal terminals and protruding portions29 Sep 2026US 12,749,626 B2Murata Manufacturing Co., Ltd.
- Multilayer electronic component22 Sep 2026US 12,744,156 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component1 Oct 2026US 2026/0302066 A1Samsung Electro-Mechanics Co., Ltd.
- Ceramic component1 Oct 2026US 2026/0302068 A1Panasonic Intellectual Property Management Co., Ltd.
- Multilayer electronic component and board having the same mounted thereon1 Oct 2026US 2026/0302072 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic component1 Oct 2026US 2026/0302074 A1Murata Manufacturing Co., Ltd.
- Bus bar for a capacitor and capacitor1 Oct 2026US 2026/0302087 A1TDK Electronics Co., Ltd.
Most cited
By later US patents
- Capacitor for multiple replacement applications107US 7,203,053 B2American Radionic Company, Inc. · 2007
- Resinated capacitive-body capacitor with interspace and explosion-preventing device104US 4,754,361 ADucati Energia S. P. A. · 1988
- Capacitor and method of manufacture104US 4,812,941 AMagnetec Corporation · 1989
- Capacitor for multiple replacement applications94US 7,474,519 B2American Radionic Company, Inc. · 2009
- Fused oil filled capacitor90US 4,107,758 ASprague Electric Company · 1978