H01F 41/127
Encapsulating or impregnating
Official title: {Encapsulating or impregnating (encapsulating coil and core H01F41/005)}
H01F41/127 (Encapsulating or impregnating) appears on 279 US grants and 313 published applications in this corpus.
Search patents in H01F- Granted patents
- 279
- Published applications
- 313
- Assignees
- 189
- Inventors
- 829
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 1 |
| 2002 | 10 | 14 |
| 2003 | 4 | 8 |
| 2004 | 8 | 10 |
| 2005 | 8 | 5 |
| 2006 | 5 | 7 |
| 2007 | 4 | 12 |
| 2008 | 3 | 10 |
| 2009 | 7 | 8 |
| 2010 | 8 | 9 |
| 2011 | 6 | 12 |
| 2012 | 6 | 7 |
| 2013 | 6 | 10 |
| 2014 | 5 | 11 |
| 2015 | 11 | 9 |
| 2016 | 6 | 10 |
| 2017 | 11 | 10 |
| 2018 | 7 | 16 |
| 2019 | 13 | 29 |
| 2020 | 14 | 23 |
| 2021 | 14 | 22 |
| 2022 | 17 | 14 |
| 2023 | 19 | 18 |
| 2024 | 12 | 13 |
| 2025 | 12 | 16 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Casting dry-type transformer and manufacturing method thereof30 Jun 2026US 12,671,026 B2Haihong Electric Co., Ltd.
- Package with mold-embedded inductor and method of fabrication therefor2 Jun 2026US 12,648,480 B2NXP USA, Inc.
- Membrane and method for molding12 May 2026US 12,623,376 B2Siemens Healthcare GmbH
- Superconducting coil, superconducting device, and liquid epoxy resin composition17 Mar 2026US 12,580,110 B2Kabushiki Kaisha Toshiba
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Vinyl ester resin composition and method for producing electrical appliance insulator using same24 Sep 2026US 2026/0290667 A1Resonac Corporation
- Inductor packages having coil with wedge electrical bonds for increased coil core area, and related fabrication methods24 Sep 2026US 2026/0290678 A1QUALCOMM Incorporated
- Inductor structure and method of manufacturing the same2 Jul 2026US 2026/0188567 A1Phoenix Pioneer Technology Co., Ltd.
- Method for manufacturing inductors and transformers with continuous winding2 Jul 2026US 2026/0188572 A1Krah IndúStria E ComéRcio De Componentes EletrôNicos Ltda
- Inductor and method for manufacturing the same11 Jun 2026US 2026/0162862 A1Chilisin Electronics Corp.
Most cited
By later US patents
- Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit96US 6,437,673 B1Canon Kabushiki Kaisha · 2002
- Wire wound electronic component84US 6,198,373 B1Taiyo Yuden Co., Ltd. · 2001
- Method of making an insulated electromagnetic coil43US 4,400,226 AGeneral Electric Company · 1983
- Wire wound electronic component and method of manufacturing the same41US 6,144,280 ATaiyo Yuden Co., Ltd. · 2000
- Method of making a coil molded into a magnetic stator39US 5,331,730 ASiemens Automotive Corporation · 1994