Inductor packages having coil with wedge electrical bonds for increased coil core area, and related fabrication methods

A method of fabricating an inductor package, comprising:

• providing a substrate;
• and
• forming an inductor coil, comprising:
• forming a plurality of metal traces on the substrate, the plurality of metal traces parallel to each other,
• each metal trace of the plurality of metal traces comprising a first bonding section in a first plane and a second bonding section in the first plane;
• and
• forming a plurality of wedge electrical bonds each comprising:
• a first flat end portion;
• a second flat end portion opposite the first flat end portion;
• and
• a raised wire coupled to the first flat end portion and the second flat end portion;
• wherein forming the plurality of wedge electrical bonds comprises, for each wedge electrical bond of the plurality of wedge electrical bonds:
• coupling the first flat end portion to the second bonding section of a first metal trace of the plurality of metal traces;
• extending the raised wire above the first plane;
• and
• coupling the second flat end portion to the first bonding section of a second metal trace of the plurality of metal traces adjacent to the first metal trace.

A method of fabricating a plurality of inductor packages, comprising:

• providing a substrate;
• forming a plurality of inductor coils, comprising:
• forming sets of metal traces on the substrate adjacent to each other from a street area therebeween, each set of metal traces comprising:
• a plurality of metal traces parallel to each other,
• each metal trace of the plurality of metal traces comprising a first bonding section in a first plane and a second bonding section in the first plane;
• each metal trace of the plurality of metal traces in the sets of metal traces extending along a common longitudinal axis to another metal trace of the plurality of metal traces in the sets of metal traces;
• and
• forming a plurality of wedge electrical bonds each extending across aligned metal traces in the sets of metal traces extending along the common longitudinal axis,
• each wedge electrical bond of the plurality of wedge electrical bonds coupling the first bonding section to the second bonding section of each of the aligned metal traces;
• and
• dicing the substrate in the street areas between adjacent sets of metal traces to form a plurality of inductor packages each having an inductor coil of the plurality of inductor coils.