H01F 1/1475
The particles being insulated
Official title: {the particles being insulated}
H01F1/1475 (The particles being insulated) appears on 44 US grants and 66 published applications in this corpus.
Search patents in H01F- Granted patents
- 44
- Published applications
- 66
- Assignees
- 46
- Inventors
- 176
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 4 | 3 |
| 2004 | 1 | 10 |
| 2005 | 2 | 6 |
| 2006 | 1 | 2 |
| 2007 | 4 | 2 |
| 2008 | 3 | 0 |
| 2009 | 3 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 3 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 3 | 3 |
| 2018 | 1 | 3 |
| 2019 | 3 | 8 |
| 2020 | 1 | 1 |
| 2021 | 2 | 5 |
| 2022 | 2 | 5 |
| 2023 | 4 | 4 |
| 2024 | 3 | 2 |
| 2025 | 1 | 0 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Magnetic resin composition, cured product, and electronic component6 Oct 2026US 12,755,880 B2FUJIFILM Corporation
- Soft magnetic metal powder, dust core, magnetic component, and electronic component16 Jun 2026US 12,658,345 B2TDK Corporation
- Electronic component10 Mar 2026US 12,573,529 B2TDK Corporation
- Coil-type electronic component10 Mar 2026US 12,573,539 B2TDK Corporation
- Soft magnetic alloy powder, soft magnetic sintered body, and coil-type electronic component14 Oct 2025US 12,440,892 B2TDK Corporation
- Electronic component and information reading method1 Oct 2026US 2026/0302018 A1TDK Corporation
- Preparation method for iron-nickel magnetic powder core material26 Mar 2026US 2026/0088201 A1Hengdian Group Dmegc Magnetics Co., Ltd
- Packaged module with novel composite magnetic molding material12 Feb 2026US 2026/0045395 A1Monolithic Power Systems, Inc.
- Soft magnetic alloy powder, magnetic core, magnetic component, and electronic device29 Feb 2024US 2024/0071660 A1TDK Corporation
- Soft magnetic alloy sheet, preparation method therefor and use thereof15 Feb 2024US 2024/0055166 A1Hengdian Group Dmegc Magnetics Co., Ltd
Most cited
By later US patents
- Polymeric resin bonded magnets40US 6,872,325 B2General Electric Company · 2005
- Robust multilayer magnetic pigments and foils30US 7,169,472 B2JDS Uniphase Corporation · 2007
- Method of producing alloy powders, alloy powders obtained by said method, and products applying said powders22US 6,540,811 B2Sumitomo Electric Fine Polymer, Inc. · 2003
- Coated ferromagnetic particles and composite magnetic articles thereof22US 6,808,807 B2General Electric Company · 2004
- Composite sintered magnetic material, its manufacturing method, and magnetic element using composite sintered magnetic material18US 7,422,697 B2Matsushita Electric Industrial Co., Ltd. · 2008