H01F 1/14741
Pressed, sintered or bonded together
Official title: {pressed, sintered or bonded together}
H01F1/14741 (Pressed, sintered or bonded together) appears on 78 US grants and 111 published applications in this corpus.
Search patents in H01F- Granted patents
- 78
- Published applications
- 111
- Assignees
- 71
- Inventors
- 262
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 4 | 3 |
| 2004 | 1 | 12 |
| 2005 | 3 | 6 |
| 2006 | 1 | 2 |
| 2007 | 4 | 3 |
| 2008 | 3 | 0 |
| 2009 | 3 | 1 |
| 2010 | 0 | 3 |
| 2011 | 0 | 3 |
| 2012 | 2 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 0 | 2 |
| 2016 | 2 | 3 |
| 2017 | 4 | 6 |
| 2018 | 4 | 6 |
| 2019 | 4 | 14 |
| 2020 | 2 | 5 |
| 2021 | 4 | 11 |
| 2022 | 3 | 7 |
| 2023 | 8 | 7 |
| 2024 | 11 | 5 |
| 2025 | 4 | 4 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Magnetic resin composition, cured product, and electronic component6 Oct 2026US 12,755,880 B2FUJIFILM Corporation
- Magnetic material and rotating electric machine23 Jun 2026US 12,665,111 B2Kabushiki Kaisha Toshiba
- Soft magnetic metal powder, dust core, magnetic component, and electronic component16 Jun 2026US 12,658,345 B2TDK Corporation
- FeNi ordered alloy structural body and method for manufacturing the same28 Apr 2026US 12,614,653 B2Denso Corporation
- Electronic component10 Mar 2026US 12,573,529 B2TDK Corporation
- Electronic component and information reading method1 Oct 2026US 2026/0302018 A1TDK Corporation
- Preparation method for iron-nickel magnetic powder core material26 Mar 2026US 2026/0088201 A1Hengdian Group Dmegc Magnetics Co., Ltd
- Soft-magnetic metal powder, production method for same, and resin composition12 Mar 2026US 2026/0074099 A1Toda Kogyo Corporation
- Packaged module with novel composite magnetic molding material12 Feb 2026US 2026/0045395 A1Monolithic Power Systems, Inc.
- Soft magnetic powder and inductor20 Nov 2025US 2025/0357029 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Magnetic device with high saturation current and low core loss51US 8,723,629 B1Cyntec Co., Ltd. · 2014
- Polymeric resin bonded magnets40US 6,872,325 B2General Electric Company · 2005
- Robust multilayer magnetic pigments and foils30US 7,169,472 B2JDS Uniphase Corporation · 2007
- Composites with large magnetostriction24US 6,849,195 B2Delphi Technologies, Inc. · 2005
- Method of producing alloy powders, alloy powders obtained by said method, and products applying said powders22US 6,540,811 B2Sumitomo Electric Fine Polymer, Inc. · 2003