H01C 7/008
Thermistors
Official title: {Thermistors (H01C7/02 - H01C7/06 take precedence)}
H01C7/008 (Thermistors) appears on 403 US grants and 484 published applications in this corpus.
Search patents in H01C- Granted patents
- 403
- Published applications
- 484
- Assignees
- 194
- Inventors
- 943
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 2 |
| 2002 | 5 | 6 |
| 2003 | 5 | 11 |
| 2004 | 3 | 9 |
| 2005 | 3 | 9 |
| 2006 | 8 | 9 |
| 2007 | 6 | 12 |
| 2008 | 6 | 5 |
| 2009 | 6 | 11 |
| 2010 | 6 | 11 |
| 2011 | 10 | 13 |
| 2012 | 10 | 16 |
| 2013 | 19 | 34 |
| 2014 | 17 | 35 |
| 2015 | 22 | 53 |
| 2016 | 26 | 37 |
| 2017 | 42 | 37 |
| 2018 | 30 | 25 |
| 2019 | 33 | 21 |
| 2020 | 24 | 24 |
| 2021 | 18 | 27 |
| 2022 | 20 | 17 |
| 2023 | 12 | 12 |
| 2024 | 18 | 18 |
| 2025 | 13 | 16 |
| 2026 | 7 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laminated ceramic component15 Sep 2026US 12,738,399 B2Panasonic Intellectual Property Management Co., Ltd.
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Electronic component9 Jun 2026US 12,651,683 B2Murata Manufacturing Co., Ltd.
- Temperature measurement arrangement in a power module26 May 2026US 12,638,341 B2ABB E-mobility B.V.
- Battery pack26 May 2026US 12,640,423 B2Denso Corporation
- Ceramic component1 Oct 2026US 2026/0302068 A1Panasonic Intellectual Property Management Co., Ltd.
- Ceramic sensor with metallization layers16 Jul 2026US 2026/0204460 A1
- Method for semiconductor bridge current protection based on vanadium dioxide thick-film thermistor9 Jul 2026US 2026/0196390 A1Hangzhou Dianzi University
- Circuit protection device2 Jul 2026US 2026/0188999 A1Smart Electronics Inc.
- Electronic device and electronic module18 Jun 2026US 2026/0171289 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Method of fabricating vertical structure LEDs183US 7,928,465 B2LG Electronics Inc. · 2011
- Plated terminations97US 6,960,366 B2AVX Corporation · 2005
- Method for forming plated terminations93US 7,152,291 B2AVX Corporation · 2006
- Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts86US 7,470,999 B2Nippon Electric Glass Co., Ltd. · 2008
- Plated terminations84US 7,154,374 B2AVX Corporation · 2006