H01B 3/40
Epoxy resins
Official title: epoxy resins
H01B3/40 (Epoxy resins) appears on 520 US grants and 339 published applications in this corpus.
Search patents in H01B- Granted patents
- 520
- Published applications
- 339
- Assignees
- 283
- Inventors
- 1,334
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 5 | 0 |
| 1978 | 17 | 0 |
| 1979 | 7 | 0 |
| 1980 | 10 | 0 |
| 1981 | 15 | 0 |
| 1982 | 11 | 0 |
| 1983 | 11 | 0 |
| 1984 | 17 | 0 |
| 1985 | 13 | 0 |
| 1986 | 20 | 0 |
| 1987 | 24 | 0 |
| 1988 | 11 | 0 |
| 1989 | 9 | 0 |
| 1990 | 13 | 0 |
| 1991 | 13 | 0 |
| 1992 | 15 | 0 |
| 1993 | 16 | 0 |
| 1994 | 27 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 9 | 0 |
| 1998 | 9 | 0 |
| 1999 | 13 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 0 |
| 2002 | 4 | 2 |
| 2003 | 5 | 4 |
| 2004 | 3 | 6 |
| 2005 | 2 | 4 |
| 2006 | 1 | 5 |
| 2007 | 2 | 13 |
| 2008 | 1 | 3 |
| 2009 | 0 | 7 |
| 2010 | 1 | 11 |
| 2011 | 4 | 12 |
| 2012 | 5 | 11 |
| 2013 | 5 | 20 |
| 2014 | 9 | 39 |
| 2015 | 10 | 34 |
| 2016 | 15 | 22 |
| 2017 | 10 | 21 |
| 2018 | 19 | 34 |
| 2019 | 17 | 19 |
| 2020 | 18 | 20 |
| 2021 | 15 | 11 |
| 2022 | 4 | 10 |
| 2023 | 7 | 15 |
| 2024 | 16 | 9 |
| 2025 | 10 | 3 |
| 2026 | 11 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Gas insulated electric apparatus15 Sep 2026US 12,738,719 B2Hitachi Energy Ltd
- Coated electric cable sealing composition, and method for sealing coated electric cable8 Sep 2026US 12,729,300 B2Toagosei Co., Ltd.
- Epoxy resin composition and ignition coil25 Aug 2026US 12,715,959 B2KYOCERA Corporation
- Shielded busbar25 Aug 2026US 12,719,253 B2Eae Elektrik Asansor Endustri Insaat Sanayi Veticaret Anonim Sir
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Electronic component18 Jun 2026US 2026/0171287 A1Nihon Parkerizing Co., Ltd.
- Pole Part16 Apr 2026US 2026/0106054 A1ABB Schweiz AG
- Epoxy resin composition5 Feb 2026US 2026/0035591 A1Shin-Etsu Chemical Co., Ltd.
- Uv-curable composition and use thereof22 Jan 2026US 2026/0022202 A1Dow Silicones Corporation
- Electronic component10 Jul 2025US 2025/0223462 A1Nihon Parkerizing Co., Ltd.
Most cited
By later US patents
- Method of producing boards for printed wiring159US 5,449,480 AHitachi Chemical Company, Ltd. · 1995
- Corona-resistant insulation, electrical conductors covered therewith and dynamoelectric machines and transformers incorporating components of such insulated conductors86US 4,760,296 AGeneral Electric Company · 1988
- Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity77US 4,358,552 AMorton-Norwich Products, Inc. · 1982
- Fiber/resin composites, and method of making the same75US 4,892,764 ALoctite Corporation · 1990
- High maximum service temperature low cure temperature non-linear electrical grading coatings resistant to V.P.I. resins containing highly reactive components69US 4,427,740 AWestinghouse Electric Corp. · 1984