Epoxy resin composition

Abstract

One of the purposes of the present invention is to provide an epoxy resin composition having excellent storage stability and curability while being curable at a low temperature in a short period of time. The present invention provides an epoxy resin composition comprising: (A) a non-silicone-modified epoxy resin having two or more epoxy groups per molecule; (B) an aromatic amine-based curing agent having two or more amino groups per molecule, in an effective amount for curing the epoxy resin; (C) a silicone-modified epoxy resin, in an amount of 1 to 200 parts by mass, relative to 100 parts by mass of component (A); (D) an aluminum chelate compound, in an amount of 0.05 parts by mass or more and less than 3.0 parts by mass, relative to 100 parts by mass of the total of components (A), (B), and (C); (E) at least one selected from an alkoxysilane having one or more phenyl groups per molecule and one or more alkoxy groups per molecule, and a partially hydrolyzed condensate of the alkoxysilane, in an amount of 0.5 parts by mass or more and less than 3.0 parts by mass, relative to 100 parts by mass of the total of components (A), (B), and (C); and (F) an inorganic filler, in an amount of 10 parts by mass or more and 1,000 parts by mass or less, relative to 100 parts by mass of the total of components (A), (B), and (C).

Dependencies are inferred from the claim text.