G06F 2119/08
Thermal analysis or thermal optimisation
G06F2119/08 (Thermal analysis or thermal optimisation) appears on 785 US grants and 1,167 published applications in this corpus.
Search patents in G06F- Granted patents
- 785
- Published applications
- 1,167
- Assignees
- 582
- Inventors
- 3,226
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 8 |
| 2003 | 7 | 11 |
| 2004 | 7 | 9 |
| 2005 | 5 | 16 |
| 2006 | 10 | 11 |
| 2007 | 8 | 28 |
| 2008 | 9 | 30 |
| 2009 | 18 | 44 |
| 2010 | 18 | 19 |
| 2011 | 26 | 26 |
| 2012 | 26 | 36 |
| 2013 | 48 | 39 |
| 2014 | 31 | 34 |
| 2015 | 28 | 39 |
| 2016 | 34 | 51 |
| 2017 | 31 | 35 |
| 2018 | 42 | 31 |
| 2019 | 38 | 58 |
| 2020 | 51 | 70 |
| 2021 | 52 | 96 |
| 2022 | 61 | 96 |
| 2023 | 57 | 101 |
| 2024 | 60 | 86 |
| 2025 | 56 | 119 |
| 2026 | 39 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for designing a discrete device product22 Sep 2026US 12,743,567 B2Semiconductor Components Industries, LLC
- Chip design method using secondary development capability of EDA software15 Sep 2026US 12,737,517 B2Batelab Co., Ltd.
- Method for constructing initial structure of athermal optical system based on particle swarm optimization algorithm1 Sep 2026US 12,724,224 B2Xi'an Institute of Optics and Precision Mechanics of Cas
- Machine learning model based controller for rapid thermal processing chamber18 Aug 2026US 12,711,290 B2APPLIED Materials.Inc.
- Neural network initialization18 Aug 2026US 12,711,384 B2PassiveLogic, Inc.
- Efficiency-Aware Performance Bounds in SoC Design8 Oct 2026US 2026/0310855 A1Google Inc.
- Dummy fill layout optimization method and system8 Oct 2026US 2026/0310873 A1Samsung Electronics Co., Ltd.
- Neural Network Initialization8 Oct 2026US 2026/0310969 A1PassiveLogic, Inc.
- System and method for modeling a nuclear reactor1 Oct 2026US 2026/0300586 A1TerraPower, LLC
- Physics-guided thermal history control and microstructure prediction for laser powder bed fusion additive manufacturing17 Sep 2026US 2026/0273866 A1
Most cited
By later US patents
- Method and apparatus for improving building energy simulations296US 6,134,511 A2000
- Methods and apparatuses for thermal analysis based circuit design235US 7,366,997 B1Synplicity, Inc. · 2008
- Thermal powerline rating and clearance analysis using thermal imaging technology230US 8,374,821 B2Utility Risk Management Corporation, LLC · 2013
- Semiconductor process and performance sensor185US 10,614,184 B2Atlazo, Inc. · 2020
- Device and method for parallel simulation task generation and distribution143US 6,345,240 B12002