G06F 13/4095
In incremental bus architectures
Official title: {in incremental bus architectures, e.g. bus stacks}
G06F13/4095 (In incremental bus architectures) appears on 63 US grants and 57 published applications in this corpus.
Search patents in G06F- Granted patents
- 63
- Published applications
- 57
- Assignees
- 52
- Inventors
- 159
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 3 |
| 2003 | 2 | 6 |
| 2004 | 6 | 5 |
| 2005 | 5 | 2 |
| 2006 | 4 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 4 |
| 2009 | 1 | 1 |
| 2010 | 2 | 1 |
| 2011 | 1 | 4 |
| 2012 | 2 | 1 |
| 2013 | 2 | 3 |
| 2014 | 1 | 1 |
| 2015 | 1 | 1 |
| 2016 | 1 | 2 |
| 2017 | 0 | 1 |
| 2018 | 2 | 6 |
| 2019 | 3 | 0 |
| 2020 | 2 | 1 |
| 2021 | 3 | 3 |
| 2022 | 0 | 2 |
| 2023 | 2 | 0 |
| 2024 | 0 | 4 |
| 2025 | 2 | 1 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Memory module adapter card with multiplexer circuitry9 Jun 2026US 12,650,945 B2Intel Corporation
- Data processing apparatus and method28 Apr 2026US 12,613,824 B2Huawei Technologies Co., Ltd.
- Method and apparatus for PCIE interface compatible with use of yinshan card, and storage medium27 Jan 2026US 12,535,866 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Memory module connection interface for power delivery24 Jun 2025US 12,342,461 B2Dell Products L. P.
- Modular wireless sensor architecture for internet of things17 Jun 2025US 12,332,833 B2Brocere Electronics company limited
- Method and apparatus for pcie interface compatible with use of yinshan card, and storage medium28 Aug 2025US 2025/0271914 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
- Motherboard and computing device4 Jul 2024US 2024/0220439 A1Huawei Technologies Co., Ltd.
- Modular wireless sensor architecture for internet of things9 May 2024US 2024/0152481 A1Brocere Electronics company limited
- Memory module connection interface for power delivery4 Jan 2024US 2024/0004439 A1Dell Products L. P.
- Memory module connection interface for power delivery4 Jan 2024US 2024/0008181 A1Dell Products L. P.
Most cited
By later US patents
- System for enabling stacking of autochanger modules262US 6,269,411 B1Hewlett-Packard Company · 2001
- Stacked module assembly including electrically interconnected switching module and plural electronic modules228US 5,568,356 AHughes Aircraft Company · 1996
- High performance mass storage subsystem87US 5,737,189 AArtecon · 1998
- Scalable data collection and computing apparatus77US 6,678,747 B2Honeywell International Inc. · 2004
- Method and apparatus for interconnection of multiple modules65US 5,793,998 ADigital Equipment Corporation · 1998