G05B 2219/49085
Cmp end point analysis, measure parameters on points to detect end of
Official title: CMP end point analysis, measure parameters on points to detect end of polishing process
G05B2219/49085 (Cmp end point analysis, measure parameters on points to detect end of) appears on 14 US grants and 13 published applications in this corpus.
Search patents in G05B- Granted patents
- 14
- Published applications
- 13
- Assignees
- 9
- Inventors
- 23
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 2 | 4 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Filtering during in-situ monitoring of polishing30 Apr 2024US 11,969,855 B2APPLIED Materials.Inc.
- Filtering during in-situ monitoring of polishing20 Jun 2023US 11,679,466 B2APPLIED Materials.Inc.
- Filtering during in-situ monitoring of polishing20 Sep 2022US 11,446,783 B2APPLIED Materials.Inc.
- Polishing with pre deposition spectrum7 Nov 2017US 9,811,077 B2APPLIED Materials.Inc.
- Adaptive endpoint method for pad life effect on chemical mechanical polishing10 May 2016US 9,333,619 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Filtering during in-situ monitoring of polishing14 Sep 2023US 2023/0286105 A1APPLIED Materials.Inc.
- Filtering during in-situ monitoring of polishing8 Dec 2022US 2022/0388113 A1APPLIED Materials.Inc.
- Filtering During In-Situ Monitoring of Polishing12 Sep 2019US 2019/0275633 A1APPLIED Materials.Inc.
- Polishing with pre deposition spectrum21 Jan 2016US 2016/0018815 A1APPLIED Materials.Inc.
- Remote monitoring system for polishing end point detection units10 Oct 2013US 2013/0268106 A1Ebara Corporation
Most cited
By later US patents
- Polishing apparatus and polishing method54US 5,904,609 AFujitsu Limited · 1999
- Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process48US 6,159,075 AVLSI Technology, Inc. · 2000
- End point polishing apparatus and polishing method42US 5,876,265 AFujitsu Limited · 1999
- CMP process involving frequency analysis-based monitoring26US 6,431,953 B1Cabot Microelectronics Corporation · 2002
- Adaptive endpoint method for pad life effect on chemical mechanical polishing14US 8,367,429 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013