G05B 2219/49057
Controlling temperature of workpiece, tool, probe holder
G05B2219/49057 (Controlling temperature of workpiece, tool, probe holder) appears on 31 US grants and 18 published applications in this corpus.
Search patents in G05B- Granted patents
- 31
- Published applications
- 18
- Assignees
- 13
- Inventors
- 34
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 3 |
| 2002 | 5 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 1 | 0 |
| 2018 | 1 | 1 |
| 2019 | 0 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 2 |
| 2022 | 2 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate processing apparatus and substrate processing method18 Nov 2025US 12,474,686 B2Tokyo Electron Limited
- Method for operating a numerically controlled production machine, and corresponding numerical control23 Sep 2025US 12,422,816 B2Siemens Aktiengesellschaft
- Metal part extrusion control13 Feb 2024US 11,897,013 B2Boothroyd Dewhurst, Inc.
- Warm-up method for machine system8 Nov 2022US 11,493,900 B2Hiwin Technologies Corp.
- Method for controlling a power tool and power tool configured for carrying out the method22 Feb 2022US 11,256,227 B2Scheppach Fabrikation von Holzbearbeitungsmaschinen GmbH
- Temperature control method28 Mar 2024US 2024/0103482 A1Tokyo Electron Limited
- Method for operating a numerically controlled production machine, and corresponding numerical control5 May 2022US 2022/0137587 A1Siemens Aktiengesellschaft
- Temperature control method6 May 2021US 2021/0132575 A1Tokyo Electron Limited
- Warm-up method for machine system25 Feb 2021US 2021/0055707 A1Hiwin Technologies Corp.
- Metal part extrusion control24 Dec 2020US 2020/0398324 A1Boothroyd Dewhurst, Inc.
Most cited
By later US patents
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997