G05B 2219/37577
In-process and post-process measurement combined
G05B2219/37577 (In-process and post-process measurement combined) appears on 9 US grants and 6 published applications in this corpus.
Search patents in G05B- Granted patents
- 9
- Published applications
- 6
- Assignees
- 9
- Inventors
- 18
- Latest grant
- 24 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Calibration method and method of obtaining workpiece information24 Oct 2023US 11,794,299 B2Renishaw PLC
- Systems and methods to automate composite manufacturing quality checks18 Jan 2022US 11,225,039 B2Aurora Flight Sciences Corporation
- Automatic analysis device and specimen inspection automation system8 Sep 2020US 10,768,187 B2Hitachi High-Tech Corporation
- Shape measuring apparatus, structure manufacturing system, stage apparatus, shape measuring method, structure manufacturing method, program, and recording medium15 Aug 2017US 9,733,070 B2Nikon Corporation
- Monitoring system and method for the in-process monitoring of machine-tool components5 Feb 2008US 7,328,081 B2
- Calibration method and method of obtaining workpiece information16 Jun 2022US 2022/0184765 A1Renishaw PLC
- Systems and Methods to Automate Composite Manufacturing Quality Checks12 Dec 2019US 2019/0375171 A1Aurora Flight Sciences Corporation
- Automatic analysis device and specimen inspection automation system19 Jul 2018US 2018/0203027 A1Hitachi High-Technologies Corporation
- Shape measuring apparatus, structure manufacturing system, stage apparatus, shape measuring method, structure manufacturing method, program, and recording medium17 Sep 2015US 2015/0260507 A1Nikon Corporation
- Monitoring system and method for the in-process monitoring of machine-tool components10 Aug 2006US 2006/0178771 A1
Most cited
By later US patents
- Methods and apparatus for control of polishing pad conditioning for wafer planarization152US 5,664,987 ANational Semiconductor Corporation · 1997
- Apparatus and method for feedback-adjusting working condition for improving dimensional accuracy of processed workpieces15US 6,415,200 B1Toyota Jidosha Kabushiki Kaisha · 2002
- Machine tools11US 6,038,489 AUnova U K Ltd. · 2000
- Monitoring system and method for the in-process monitoring of machine-tool components6US 7,328,081 B22008
- Calibration method and method of obtaining workpiece information3US 11,794,299 B2Renishaw PLC · 2023