G05B 2219/37398
Thickness
G05B2219/37398 (Thickness) appears on 41 US grants and 28 published applications in this corpus.
Search patents in G05B- Granted patents
- 41
- Published applications
- 28
- Assignees
- 31
- Inventors
- 77
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 3 |
| 2002 | 5 | 2 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 2 |
| 2018 | 3 | 2 |
| 2019 | 1 | 0 |
| 2020 | 3 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 2 |
| 2023 | 0 | 4 |
| 2024 | 0 | 1 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Edge build-up measurement16 Dec 2025US 12,497,680 B2ArcelorMittal
- Process control system and operating method therefor14 Oct 2025US 12,442,086 B2Posco
- Targeted adjusting of the contour using corresponding specifications27 Dec 2022US 11,534,808 B2Primetals Technologies Germany GmbH
- Wire electrical discharge machine and control method for wire electrical discharge machine15 Dec 2020US 10,864,587 B2Fanuc Corporation
- Predictive preparation of material for joint assembly24 Nov 2020US 10,843,821 B2The Boeing Company
- Method for Operating a Press, Computer Program and Electronically Readable Data Carrier24 Oct 2024US 2024/0351300 A1Bayerische Motoren Werke Aktiengesellschaft
- Robot system, and control method5 Oct 2023US 2023/0311329 A1Fanuc Corporation
- Precision-cut casing tubular for centralizer assembly29 Jun 2023US 2023/0205163 A1Innovex Downhole Solutions, Inc.
- Process control system and operating method therefor25 May 2023US 2023/0160071 A1Posco
- Thickness compensation in a cutting and bending process12 Jan 2023US 2023/0010023 A1Bystronic Laser AG
Most cited
By later US patents
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997