G05B 2219/32336
Normal, special order lines share some common machines, part of production line
G05B2219/32336 (Normal, special order lines share some common machines, part of production line) appears on 5 US grants and 5 published applications in this corpus.
Search patents in G05B- Granted patents
- 5
- Published applications
- 5
- Assignees
- 7
- Inventors
- 15
- Latest grant
- 5 Nov 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
By publication year.
Recent patents
- Production management method of substrate in component mounting system5 Nov 2019US 10,466,685 B2Panasonic Intellectual Property Management Co., Ltd.
- Process scheduling system, method, and program9 Aug 2016US 9,409,230 B2International Business Machines Corporation
- Integrated packaging system architecture24 Sep 2013US 8,543,233 B2Tetra Laval Holdings & Finance S. A.
- Production management method and production management system18 Oct 2011US 8,041,441 B2Elpida Memory, Inc.
- Process for fabricating two different types of wafers in a semiconductor wafer production line20 Feb 2001US 6,190,424 B1Hitachi, Ltd.
- Method for Operating Cell Based Mobility Production System4 Aug 2022US 2022/0245543 A1Hyundai Motor Company
- Production management method of substrate in component mounting system28 Apr 2016US 2016/0116898 A1Panasonic Intellectual Property Management Co., Ltd.
- Process scheduling system, method, and program29 Mar 2012US 2012/0078407 A1International Business Machines Corporation
- Integrated packaging system architecture18 Nov 2010US 2010/0287879 A1Tetra Laval Holdings & Finance S. A.
- Production management method and production management system6 Nov 2008US 2008/0275584 A1Elpida Memory, Inc.
Most cited
By later US patents
- Process for fabricating two different types of wafers in a semiconductor wafer production line8US 6,190,424 B1Hitachi, Ltd. · 2001
- Integrated packaging system architecture8US 8,543,233 B2Tetra Laval Holdings & Finance S. A. · 2013
- Production management method and production management system3US 8,041,441 B2Elpida Memory, Inc. · 2011
- Process scheduling system, method, and program1US 9,409,230 B2International Business Machines Corporation · 2016