G01N 25/18
Investigating or analyzing materials by the use of thermal means: by investigating
Official title: by investigating thermal conductivity (by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18)
G01N25/18 (Investigating or analyzing materials by the use of thermal means: by investigating) appears on 874 US grants and 873 published applications in this corpus.
Search patents in G01N- Granted patents
- 874
- Published applications
- 873
- Assignees
- 634
- Inventors
- 2,278
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 9 | 0 |
| 1982 | 6 | 0 |
| 1983 | 7 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 8 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 10 | 0 |
| 1990 | 15 | 0 |
| 1991 | 17 | 0 |
| 1992 | 9 | 0 |
| 1993 | 10 | 0 |
| 1994 | 11 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 17 | 0 |
| 2000 | 5 | 0 |
| 2001 | 11 | 2 |
| 2002 | 17 | 18 |
| 2003 | 19 | 18 |
| 2004 | 15 | 12 |
| 2005 | 12 | 19 |
| 2006 | 16 | 17 |
| 2007 | 10 | 25 |
| 2008 | 21 | 17 |
| 2009 | 11 | 9 |
| 2010 | 13 | 19 |
| 2011 | 10 | 20 |
| 2012 | 11 | 24 |
| 2013 | 15 | 22 |
| 2014 | 24 | 33 |
| 2015 | 16 | 32 |
| 2016 | 26 | 48 |
| 2017 | 37 | 35 |
| 2018 | 33 | 45 |
| 2019 | 34 | 50 |
| 2020 | 46 | 71 |
| 2021 | 57 | 50 |
| 2022 | 63 | 62 |
| 2023 | 39 | 48 |
| 2024 | 46 | 73 |
| 2025 | 45 | 60 |
| 2026 | 38 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for judging aging degree of insulation of XLPE cable connector based on dynamic heat source29 Sep 2026US 12,748,064 B2China Huaneng Renewables Corporation Limited, Hubei
- Method and systems for determining a measurement error in a measurement of hydrogen concentration15 Sep 2026US 12,736,490 B2Siemens Aktiengesellschaft
- Thermal resistance determination15 Sep 2026US 12,736,491 B2Hewlett-Packard Development Company, L. P.
- Automated thermal conductivity tester1 Sep 2026US 12,723,996 B1Aroboticscompany Inc.
- Bottomhole assembly for geothermal field construction25 Aug 2026US 12,716,345 B2Bedrock Energy, Inc.
- Method for determining a flow rate of a fluid independent of the thermal properties of the fluid8 Oct 2026US 2026/0309527 A1Berkin B.V.
- Gas sensor8 Oct 2026US 2026/0309656 A1TDK Corporation
- Apparatus, method, and system for measuring thermal conductivity of secondary battery using detachable jig1 Oct 2026US 2026/0298852 A1Samsung SDI.Co., Ltd.
- Non-destructive inspection method for lining tank, non-destructive inspection system, and control program1 Oct 2026US 2026/0298853 A1National Institute of Advanced Industrial Science and Technology
- Thermal conductivity sensitivity compensation with supply voltage1 Oct 2026US 2026/0298854 A1Infineon Technologies AG
Most cited
By later US patents
- Boron nutride membrane in wafer structure239US 5,270,125 ARedwood Microsystems, Inc. · 1993
- Sensor array-based system and method for rapid materials characterization193US 6,535,824 B1Symyx Technologies, Inc. · 2003
- Sensor apparatus systems, devices and methods158US 8,491,184 B2DEKA Products Limited Partnership · 2013
- Measurement of thermal conductivity and specific heat147US 4,944,035 AHoneywell Inc. · 1990
- High throughput measurement of via defects in interconnects128US 7,026,175 B2APPLIED Materials.Inc. · 2006