G01N 2013/0208
By measuring contact angle
Official title: {by measuring contact angle}
G01N2013/0208 (By measuring contact angle) appears on 88 US grants and 96 published applications in this corpus.
Search patents in G01N- Granted patents
- 88
- Published applications
- 96
- Assignees
- 86
- Inventors
- 272
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 7 |
| 2005 | 1 | 4 |
| 2006 | 4 | 4 |
| 2007 | 3 | 2 |
| 2008 | 1 | 1 |
| 2009 | 2 | 2 |
| 2010 | 4 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 3 |
| 2014 | 3 | 2 |
| 2015 | 2 | 6 |
| 2016 | 4 | 4 |
| 2017 | 2 | 5 |
| 2018 | 5 | 1 |
| 2019 | 3 | 11 |
| 2020 | 8 | 8 |
| 2021 | 6 | 4 |
| 2022 | 7 | 14 |
| 2023 | 9 | 7 |
| 2024 | 6 | 4 |
| 2025 | 2 | 2 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of measuring contact angle of silicon wafer and method of evaluating surface condition of silicon wafer18 Aug 2026US 12,710,347 B2Sumco Corporation
- Method of cleaning semiconductor wafer and method of manufacturing semiconductor wafer20 Jan 2026US 12,532,686 B2Sumco Corporation
- Titration module, test apparatus and method for measuring titration contact angles23 Dec 2025US 12,504,412 B2King Yuan Electronics Co., Ltd.
- Method and apparatus for measuring a receding contact angle15 Jul 2025US 12,360,030 B2KRÜSS GmbH
- Method, device, and system for testing static contact angle of reagent asphalt31 Dec 2024US 12,181,397 B2Wuhan University of Technology
- Antifogging agent1 Oct 2026US 2026/0298803 A1Resonac Corporation
- Simultaneous viewing of spreading and leveling26 Mar 2026US 2026/0086031 A1Wood Coatings Research Group, Inc.
- Cyclic epipedography monitoring contact angle changes in dipping a microsphere into a liquid and lifting from it30 Jan 2025US 2025/0035529 A1New York University
- Method and Apparatus for Determining Liquid-Solid Adhesion Work16 Jan 2025US 2025/0020564 A1Hun-Ren Energiatudományi Kutatóközpont
- Method of measuring contact angle of silicon wafer and method of evaluating surface condition of silicon wafer17 Oct 2024US 2024/0344951 A1Sumco Corporation
Most cited
By later US patents
- Solid body surface evaluation method, magnetic disk evaluation method, magnetic disk, and manufacturing method thereof71US 7,174,775 B2Hoya Corporation · 2007
- Solid body surface evaluation method, magnetic disk evaluation method, magnetic disk, and manufacturing method thereof69US 7,695,833 B2Hoya Corporation · 2010
- Method and device for contact angle determination from radius of curvature of drop by optical distance measurement53US 7,952,698 B2Kruess GmbH Wissenschaftliche Laborgerate · 2011
- Modification of the degree of liquid contact with a solid by control of surface and micro-channel capillary geometry45US 6,982,787 B1The United States of America as represented by the Secretary of the Air Force · 2006
- Methods and devices for determining the contact angle of a drop of liquid placed on a substrate36US 5,115,677 APhotonetics · 1992