G01B 7/105
For measuring thickness of coating
Official title: {for measuring thickness of coating}
G01B7/105 (For measuring thickness of coating) appears on 313 US grants and 228 published applications in this corpus.
Search patents in G01B- Granted patents
- 313
- Published applications
- 228
- Assignees
- 151
- Inventors
- 499
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 6 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 2 |
| 2002 | 6 | 10 |
| 2003 | 11 | 16 |
| 2004 | 13 | 17 |
| 2005 | 15 | 11 |
| 2006 | 11 | 6 |
| 2007 | 12 | 15 |
| 2008 | 8 | 7 |
| 2009 | 4 | 4 |
| 2010 | 7 | 3 |
| 2011 | 1 | 4 |
| 2012 | 1 | 6 |
| 2013 | 3 | 6 |
| 2014 | 5 | 15 |
| 2015 | 10 | 8 |
| 2016 | 8 | 2 |
| 2017 | 3 | 2 |
| 2018 | 6 | 18 |
| 2019 | 7 | 10 |
| 2020 | 9 | 19 |
| 2021 | 14 | 9 |
| 2022 | 15 | 11 |
| 2023 | 16 | 8 |
| 2024 | 15 | 9 |
| 2025 | 7 | 4 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductive sensor interface for on-wafer plating thickness measurements7 Jul 2026US 12,674,655 B2APPLIED Materials.Inc.
- Output signal processing device for eddy-current sensor16 Jun 2026US 12,656,097 B2Ebara Corporation
- Through-transmission eddy current system for inline inspection of power source electrodes16 Jun 2026US 12,656,098 B2GM Global Technology Operations LLC
- Control system for heavy metallic coating weight26 May 2026US 12,637,749 B2NV Bekaert SA
- System, method, and apparatus for inspecting a surface31 Mar 2026US 12,591,239 B2Gecko Robotics, Inc.
- Measurement device, measurement apparatus, and measurement method20 Aug 2026US 2026/0244303 A1Yokogawa Electric Corporation
- Sensor and method for measuring a physical variable of a planar medium30 Jul 2026US 2026/0219021 A1Micro-Epsilon Messtechnik GmbH & Co.KG
- Method and sensor assembly for measuring the thickness of at least one coating layer30 Jul 2026US 2026/0219022 A1Tata Steel Ijmuiden B.V.
- Compensation for slurry composition in in-situ electromagnetic inductive monitoring16 Apr 2026US 2026/0102870 A1APPLIED Materials.Inc.
- Inductive sensor interface for on-wafer plating thickness measurements15 Jan 2026US 2026/0016280 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Multi-Parameter eddy current measuring system with parameter compensation technical field137US 5,541,510 AKaman Instrumentation Corporation · 1996
- In-situ monitoring of conductive films on semiconductor wafers97US 5,660,672 AInternational Business Machines Corporation · 1997
- Non-contact wet or dry film thickness measuring device using eddy current and ultrasonic sensors92US 5,062,298 AE. I. Du Pont de Nemours and Company · 1991
- Low cost magnetic coating thickness gauge with holding magnet, bias spring and holding force indicator91US 5,006,799 A1991
- Controller for inspection robot traversing an obstacle87US 11,148,292 B2Gecko Robotics, Inc. · 2021