F28F 9/027
In the form of distribution pipes
Official title: {in the form of distribution pipes}
F28F9/027 (In the form of distribution pipes) appears on 496 US grants and 653 published applications in this corpus.
Search patents in F28F- Granted patents
- 496
- Published applications
- 653
- Assignees
- 295
- Inventors
- 1,401
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 11 | 0 |
| 2000 | 8 | 0 |
| 2001 | 6 | 0 |
| 2002 | 2 | 11 |
| 2003 | 5 | 10 |
| 2004 | 8 | 7 |
| 2005 | 2 | 6 |
| 2006 | 12 | 10 |
| 2007 | 5 | 10 |
| 2008 | 2 | 15 |
| 2009 | 3 | 8 |
| 2010 | 7 | 20 |
| 2011 | 7 | 22 |
| 2012 | 6 | 17 |
| 2013 | 10 | 28 |
| 2014 | 11 | 30 |
| 2015 | 14 | 36 |
| 2016 | 17 | 50 |
| 2017 | 35 | 46 |
| 2018 | 41 | 34 |
| 2019 | 30 | 32 |
| 2020 | 35 | 40 |
| 2021 | 29 | 40 |
| 2022 | 28 | 37 |
| 2023 | 33 | 35 |
| 2024 | 31 | 36 |
| 2025 | 25 | 41 |
| 2026 | 12 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Air conditioner having refrigerant distributor29 Sep 2026US 12,747,918 B2Samsung Electronics Co., Ltd.
- Heat exchange assembly and heat exchange system7 Jul 2026US 12,674,623 B2Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd.
- Heat exchanger23 Jun 2026US 12,663,225 B2Samsung Electronics Co., Ltd.
- Heat exchanger, heat exchange assembly, and heat management system16 Jun 2026US 12,656,065 B2Zhejiang Sanhua Automotive Components Co., Ltd.
- Collector assembly and heat exchanger with simplified structure9 Jun 2026US 12,650,265 B2Sanhua Holding Group Co., Ltd.
- Heat exchange assembly and heat exchange system1 Oct 2026US 2026/0298547 A1Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd.
- Header assembly, heat exchanger and air conditioning system1 Oct 2026US 2026/0298559 A1Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd.
- Manifold-integrated coolant module24 Sep 2026US 2026/0287282 A1Hyundai Wia Corporation
- Liquid Cooling System With Buffer Tank17 Sep 2026US 2026/0276324 A1Oracle International Corporation
- A coupling device, a kit, and a heat transfer arrangement comprising the same17 Sep 2026US 2026/0276325 A1Qvantum Industries AB
Most cited
By later US patents
- Liquid-based cooling apparatus for an electronics rack99US 7,450,385 B1International Business Machines Corporation · 2008
- Plate and fin heat exchanger68US 3,976,128 AFord Motor Company · 1976
- Laminated evaporator59US 4,274,482 ANihon Radiator Co., Ltd. · 1981
- High performance dual-in-line memory (DIMM) array liquid cooling assembly and method58US 7,965,509 B2International Business Machines Corporation · 2011
- Multiscale transport apparatus and methods57US 6,688,381 B2State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University · 2004