High performance dual-in-line memory (DIMM) array liquid cooling assembly and method

An assembly for cooling electronic heat generating components of a computer including a plurality of dual-in-line memory (DIMM) arrays, comprising:

• a plurality of cooling components, each cooling component comprising a plate with a first main side and a second main side, the first main side of each plate being thermally coupled to a respective DIMM array of the plurality of DIMM arrays, and wherein at least one DIMM array is disposed between and thermally coupled opposing first main sides of two adjacent cooling components of the plurality of cooling components;
• a plurality of coolant conduits, each coolant conduit being coupled to the plate of a respective cooling component of the plurality of cooling components, and each coolant conduit being connected at one end to a common supply manifold via a first flexible tubing and at another end to a common return manifold via a second flexible tubing such that when coolant is supplied, the coolant circulates from the supply manifold to the return manifold by passing through the plurality of coolant conduits coupled to the second main sides of the plates of the plurality of cooling components;
• and
• a plurality of springs, at least one spring of the plurality of springs being coupled to the second main side of each plate of the two adjacent cooling components with the opposing first main sides of the plates between which the at least one DIMM array is disposed, wherein the plurality of springs facilitate thermal coupling of the at least one DIMM array to the opposing first main sides of the two adjacent cooling components of the plurality of cooling components.

A method for cooling electronic heat generating components of a computer including a plurality of dual-in-line memory (DIMM) arrays, the method comprising:

• thermally coupling a plurality of cooling components to the plurality of DIMM arrays, each cooling component comprising a plate with a first main side and a second main side, the first main side of each plate being thermally coupled to a respective DIMM array of the plurality of DIMM arrays, and wherein at least one DIMM array is disposed between and thermally coupled to opposing first main sides of two adjacent cooling components of the plurality of cooling components;
• providing for circulation of coolants by providing a plurality of coolant conduits, each coolant conduit being coupled to the second main side of a plate of a respective cooling component of the plurality of cooling components, and each coolant conduit being connected to a common supply manifold via a first flexible tubing and to a common return manifold via a second flexible tubing;
• and
• providing a plurality of springs, wherein at least one spring of the plurality of springs is coupled to the second main side of each plate of the two adjacent cooling components with the opposing first main sides of the plates between which the at least one DIMM array is disposed, wherein the plurality of springs facilitate thermal coupling of the at least one DIMM array to the opposing first main sides of the two adjacent cooling components of the plurality of cooling components.