F28F 2215/14
In the form of movable or loose fins
Official title: in the form of movable or loose fins
F28F2215/14 (In the form of movable or loose fins) appears on 51 US grants and 60 published applications in this corpus.
Search patents in F28F- Granted patents
- 51
- Published applications
- 60
- Assignees
- 49
- Inventors
- 141
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 1 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 3 |
| 2012 | 0 | 0 |
| 2013 | 0 | 4 |
| 2014 | 3 | 1 |
| 2015 | 1 | 1 |
| 2016 | 3 | 1 |
| 2017 | 5 | 10 |
| 2018 | 4 | 7 |
| 2019 | 6 | 7 |
| 2020 | 6 | 4 |
| 2021 | 5 | 5 |
| 2022 | 1 | 2 |
| 2023 | 3 | 3 |
| 2024 | 3 | 4 |
| 2025 | 3 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Deformable fin heat exchanger17 Jun 2025US 12,332,003 B2Socpra Sciences Et Genie S. E. C.
- Cover fin and heat exchanger unit including the same13 May 2025US 12,298,087 B2Kyungdong Navien Co., Ltd.
- Heat dissipation module and connector29 Apr 2025US 12,287,159 B2Tyco Electronics (Shanghai) Co., Ltd.
- Heat exchanger11 Jun 2024US 12,007,178 B2Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd.
- Deformable fin heat exchanger2 Apr 2024US 11,946,705 B2Socpra Sciences Et Genie S. E. C.
- Cooling system for use in cold ambient conditions28 May 2026US 2026/0146809 A1Vertiv Corporation
- Heatsink and Connector Assembly2 Jan 2025US 2025/0007207 A1Tyco Electronics (Shanghai) Co., Ltd.
- Deformable fin heat exchanger25 Jul 2024US 2024/0247883 A1Socpra Sciences Et Genie S. E. C.
- Cover fin and heat exchanger unit including the same4 Jul 2024US 2024/0219128 A1Kyungdong Navien Co., Ltd.
- Cooling apparatus, system and method of manufacture20 Jun 2024US 2024/0206131 A1Katrick Technologies Limited
Most cited
By later US patents
- Method and apparatus for cooling an electronic device70US 6,050,326 AInternational Business Machines Corporation · 2000
- Heat exchanger24US 5,558,156 AHonda Giken Kogyo Kabushiki · 1996
- Flexible foil finned heatsink structure and method of making same20US 6,026,895 AFujitsu Limited · 2000
- Extendable heat dissipation apparatus20US 7,411,791 B2ASUSTeK COMPUTER INC. · 2008
- Fan casing assembly with cooler and method of moving17US 11,008,943 B2Unison Industries, LLC · 2021