Heat dissipation module and connector
AssigneeTyco Electronics (Shanghai) Co., Ltd.
InventorsWenYu (Vindy) Liu, Xingjie (Steven) Ge, Xinbo (Polly) Liu
Life of this patent
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AssigneeTyco Electronics (Shanghai) Co., Ltd.
InventorsWenYu (Vindy) Liu, Xingjie (Steven) Ge, Xinbo (Polly) Liu
Estimating the term…
A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adjacent heat dissipation units are each coupled with one of the heat dissipation fins of a second heat dissipation unit of the pair of adjacent heat dissipation units by a coupling structure. The heat dissipation fins of the first heat dissipation unit and the heat dissipation fins of the second heat dissipation unit are displaceable with respect to each other within a certain range.
A heat dissipation module, comprising:
A heat dissipation module, comprising:
A connector, comprising:
Dependencies are inferred from the claim text.