F28D 2015/0225
Microheat pipes
Official title: {Microheat pipes}
F28D2015/0225 (Microheat pipes) appears on 94 US grants and 124 published applications in this corpus.
Search patents in F28D- Granted patents
- 94
- Published applications
- 124
- Assignees
- 84
- Inventors
- 240
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 9 |
| 2004 | 2 | 5 |
| 2005 | 3 | 8 |
| 2006 | 6 | 6 |
| 2007 | 2 | 2 |
| 2008 | 4 | 4 |
| 2009 | 0 | 5 |
| 2010 | 5 | 9 |
| 2011 | 1 | 4 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 2 | 0 |
| 2015 | 4 | 1 |
| 2016 | 2 | 0 |
| 2017 | 1 | 8 |
| 2018 | 1 | 8 |
| 2019 | 9 | 9 |
| 2020 | 6 | 6 |
| 2021 | 5 | 6 |
| 2022 | 7 | 8 |
| 2023 | 5 | 12 |
| 2024 | 7 | 2 |
| 2025 | 2 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for achieving scalable two-phase cooling plates14 Apr 2026US 12,604,436 B2University of South Carolina
- Vapor chamber assembly3 Mar 2026US 12,566,032 B2Signify Holding B. V.
- Micro heat pipe for use in semiconductor IC chip package6 Jan 2026US 12,519,033 B2iCometrue Company Ltd.
- Methods for interfacing a metallic microchannel and a metallic capillary16 Sep 2025US 12,416,452 B2Brigham Young University
- Integrated heat spreader21 Jan 2025US 12,203,706 B2Nokia Technologies Oy
- In-situ fill fraction adjustment of oscillating heat pipe17 Sep 2026US 2026/0276318 A1ThermAvant Technologies, LLC
- Flow thruster for heat pipe microchannel18 Jun 2026US 2026/0168740 A1Raytheon Company
- Micro heat pipe for use in semiconductor ic chip package9 Apr 2026US 2026/0101751 A1iCometrue Company Ltd.
- Electronic device comprising heat dissipation structure5 Feb 2026US 2026/0040494 A1Samsung Electronics Co., Ltd.
- Display device10 Jul 2025US 2025/0228114 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Method of making micro channel heat pipe having corrugated fin elements105US 6,216,343 B1The United States of America as represented by the Secretary of the Air Force · 2001
- Structure of micro-heat pipe96US 5,219,020 AActronics Kabushiki Kaisha · 1993
- Rapid shape memory effect micro-actuators91US 5,309,717 A1994
- Thermal energy storage heat exchanger88US 4,976,308 AWright State University · 1990
- Vapor deposited micro heat pipes76US 5,179,043 AThe Texas A&M University System · 1993