Electronic device comprising heat dissipation structure

An electronic device comprising:

• an electronic component;
• and
• a vapor chamber configured to receive at least a portion of heat emitted from the electronic component, and including a first plate, a second plate supporting the first plate, and a wick structure between the first plate and the second plate,
• wherein the first plate includes:
• a first region including a heat dissipation portion facing the electronic component, and
• a second region connected to the first region,
• wherein the wick structure includes:
• a first wick including a first portion covering one surface of the first region facing the second plate, and a second portion extending from the first portion along the second region and including first flow paths spaced apart from each other, and
• a second wick extending from the second plate to the second portion and including a second flow paths contacting the first flow paths respectively, and
• wherein a width of the first portion is greater than a width of the second portion.