F28D 15/0275
Arrangements for coupling heat-pipes together or with other structures
Official title: {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores}
F28D15/0275 (Arrangements for coupling heat-pipes together or with other structures) appears on 1,511 US grants and 2,096 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,511
- Published applications
- 2,096
- Assignees
- 793
- Inventors
- 3,581
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 10 | 0 |
| 1978 | 10 | 0 |
| 1979 | 8 | 0 |
| 1980 | 9 | 0 |
| 1981 | 10 | 0 |
| 1982 | 8 | 0 |
| 1983 | 11 | 0 |
| 1984 | 16 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 11 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 8 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 12 | 0 |
| 1999 | 11 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 7 |
| 2002 | 19 | 19 |
| 2003 | 13 | 37 |
| 2004 | 25 | 32 |
| 2005 | 30 | 61 |
| 2006 | 35 | 60 |
| 2007 | 33 | 74 |
| 2008 | 35 | 94 |
| 2009 | 41 | 101 |
| 2010 | 51 | 102 |
| 2011 | 45 | 93 |
| 2012 | 53 | 118 |
| 2013 | 44 | 139 |
| 2014 | 50 | 90 |
| 2015 | 54 | 88 |
| 2016 | 61 | 81 |
| 2017 | 45 | 101 |
| 2018 | 76 | 95 |
| 2019 | 80 | 131 |
| 2020 | 93 | 129 |
| 2021 | 91 | 100 |
| 2022 | 70 | 83 |
| 2023 | 74 | 89 |
| 2024 | 62 | 56 |
| 2025 | 57 | 68 |
| 2026 | 30 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Medical cooling device and cooling method using the same15 Sep 2026US 12,734,065 B2RecensMedical, Inc.
- Movable heat pipe heat sink device configured to move into and out of contact with an apparatus8 Sep 2026US 12,729,917 B2The Boeing Company
- Heat dissipation module and projection apparatus1 Sep 2026US 12,724,336 B2Coretronic Corporation
- Loop heat pipe one-way circulation device7 Jul 2026US 12,674,626 B2Auras Technology Co., Ltd.
- Systems and methods for heat transfer using heat pipes7 Jul 2026US 12,674,627 B2Trane Technologies Life Sciences LLC
- Penetration-free heat transfer system17 Sep 2026US 2026/0276315 A1Government of the United States as Represented by the Secretary of the Air Force
- Cooling element17 Sep 2026US 2026/0276316 A1Thermal Channel Technologies Oy
- Three-dimensional heat exchanger17 Sep 2026US 2026/0276317 A1Purple Cloud Development Pte. Ltd.
- Electronic equipment cooling system with heat transfer fluid20 Aug 2026US 2026/0242649 A1Enover Isi Sistemleri Anonim Sirketi
- Three-dimensional heat transfer device13 Aug 2026US 2026/0235366 A1Purple Cloud Development Pte. Ltd.
Most cited
By later US patents
- Structure of a heat pipe237US 4,921,041 AActronics Kabushiki Kaisha · 1990
- Cooled secondary coils of electric automobile charging transformer223US 5,408,209 AHughes Aircraft Company · 1995
- Packaging system for thermally controlling the temperature of electronic equipment182US 6,104,611 ANortel Networks Limited · 2000
- Efficiency thermoelectrics utilizing thermal isolation179US 6,539,725 B2Bsst LLC · 2003
- LED backlight unit including cooling structure149US 7,284,874 B2LG. Philips LCD Co., Ltd. · 2007