F04C 2220/28
Application: for pulsed fluid flow
Official title: for pulsed fluid flow
F04C2220/28 (Application: for pulsed fluid flow) appears on 4 US grants and 5 published applications in this corpus.
Search patents in F04C- Granted patents
- 4
- Published applications
- 5
- Assignees
- 3
- Inventors
- 9
- Latest grant
- 21 Feb 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 2 |
| 2020 | 1 | 1 |
| 2021 | 2 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
By publication year.
Recent patents
- Primary vacuum pump of dry type and method for controlling the injection of a purge gas21 Feb 2023US 11,585,342 B2Pfeiffer Vacuum GmbH
- Gas ejection apparatus30 Mar 2021US 10,962,007 B2DENSO TEN Limited
- Gas ejection apparatus5 Jan 2021US 10,883,503 B2DENSO TEN Limited
- Rotation device and extraneous-matter removing apparatus7 Jul 2020US 10,704,551 B2Fujitsu Ten Limited
- Primary vacuum pump of dry type and method for controlling the injection of a purge gas2 Apr 2020US 2020/0102960 A1Pfeiffer Vacuum GmbH
- Gas ejection apparatus16 May 2019US 2019/0145407 A1DENSO TEN Limited
- Gas ejection apparatus16 May 2019US 2019/0145413 A1DENSO TEN Limited
- Rotation device and extraneous-matter removing apparatus24 May 2018US 2018/0142688 A1Fujitsu Ten Limited
- Semiconductor manufacturing method for die bonding27 Jul 2006US 2006/0166510 A1
Most cited
By later US patents