Semiconductor manufacturing method for die bonding
OwnerMasao Okayamainventor
Life of this patent
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Abstract
The present invention has a pump system having a gear pump to which a gear structure, having a pump gear and a driving gear concentrically and integrally formed with each other, is incorporated; a main control section for controlling this pump system; and a stage that can support a plate-like member such as a lead frame. In the gear pump, driving force is given to the driving gear to rotate the pump gear, whereby a paste is applied on the plate-like member. The use of the gear pump allows the reduction in cost for manufacturing and assembling the gears, thereby being capable of reducing manufacturing cost.
Claims14
A semiconductor manufacturing method, in which a gear structure having a non-contact gear and contact gear that are concentrically and integrally formed is used, and driving force is given to the contact gear to rotate the non-contact gear for applying a paste with the non-contact gear used as a gear pump.
A semiconductor manufacturing method for applying a paste by using a gear pump having a non-contact gear, wherein the gear pump is pulse-driven by a stepping motor, and the gear pump is controlled to be rotated by a drive with a pulse number of 3000 pulses or more per one rotation thereby applying the paste.
Dependencies are inferred from the claim text.