E04F 15/042

The lower layer being of fibrous or chipped material

Official title: {the lower layer being of fibrous or chipped material, e.g. bonded with synthetic resins}

E04F15/042 (The lower layer being of fibrous or chipped material) appears on 72 US grants and 88 published applications in this corpus.

Search patents in E04F
Granted patents
72
Published applications
88
Assignees
40
Inventors
75
Latest grant
14 Apr 2026

Filings by year

E04F 15/042: granted patents and published applications per publication year
YearGranted patentsPublished applications
198210
198300
198400
198500
198600
198700
198800
198900
199000
199100
199200
199300
199400
199500
199610
199700
199800
199900
200000
200110
200200
200300
200402
200501
200601
200700
200813
200903
201000
201110
201222
201315
201438
201535
201676
201739
201874
201967
202068
202143
202273
2023410
202484
202553
202611

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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