C25D 7/0657
Conducting rolls
Official title: {Conducting rolls}
C25D7/0657 (Conducting rolls) appears on 58 US grants and 41 published applications in this corpus.
Search patents in C25D- Granted patents
- 58
- Published applications
- 41
- Assignees
- 46
- Inventors
- 152
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 1 |
| 2002 | 1 | 2 |
| 2003 | 5 | 3 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 2 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 3 |
| 2011 | 2 | 0 |
| 2012 | 1 | 4 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 6 |
| 2020 | 0 | 0 |
| 2021 | 1 | 3 |
| 2022 | 4 | 2 |
| 2023 | 1 | 1 |
| 2024 | 2 | 2 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for alkaliating roll anodes2 Jun 2026US 12,646,703 B2Nanoscale Components, Inc.
- Electroplating method for enhancing the performance of rolled-up passive components14 Oct 2025US 12,442,101 B2The Board of Trustees of the University of Illinois
- Device and method for preventing copper plating of conductor roll7 May 2024US 11,976,378 B2Chongqing Jimat New Material Technology Co., Ltd.
- Methods for alkaliating roll anodes27 Feb 2024US 11,916,217 B2Nanoscale Components, Inc.
- Conductive plating apparatus, plating system and plating method for conductive film21 Nov 2023US 11,821,100 B2Xiamen Hithium Energy Storage Technology Co., Ltd.
- Methods for alkaliating roll anodes5 Dec 2024US 2024/0405190 A1Nanoscale Components, Inc.
- Cathode conduction mechanism and electroplating system9 May 2024US 2024/0150921 A1Chongqing Jimat New Material Technology Co., Ltd.
- Conductive plating apparatus, plating system and plating method for conductive film9 Feb 2023US 2023/0042419 A1Xiamen Hithium Energy Storage Technology Co., Ltd.
- Device and method for preventing copper plating of conductor roll8 Sep 2022US 2022/0282390 A1Chongqing Jimat New Material Technology Co., Ltd.
- Electroplating Method for Enhancing the Performance of Rolled-Up Passive Components21 Apr 2022US 2022/0119976 A1The Board of Trustees of the University of Illinois
Most cited
By later US patents
- Electroplating apparatus and method40US 4,385,967 AChemcut Corporation · 1983
- Apparatus for in line plating22US 6,153,064 AOliver Sales Company · 2000
- Method and device for continuous uniform electrolytic metallizing or etching19US 5,804,052 AAtotech Deutschland GmbH · 1998
- Electroplating apparatus and method14US 4,459,183 AChemcut Corporation · 1984
- Continuous plating apparatus8US 6,174,418 B12001