Conductive plating apparatus, plating system and plating method for conductive film

A plating system, configured to form a first plating layer and a second plating layer on a conductive film, the plating system comprising:

• a conductive plating apparatus configured to electrically connect the conductive film with a power supply, the conductive plating apparatus comprising:
• a first conductive structure comprising a first conductive roller and a first press roller;
• and
• a second conductive structure comprising a second conductive roller and a second press roller;
• and
• a first plating tank and a second plating tank configured to contain plating solution,
• wherein the first conductive structure and the second conductive structure are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second conductive roller and the second press roller;
• wherein the first press roller and the second press roller are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film respectively;
• wherein the first press roller and the second conductive roller are configured to be equipotential;
• wherein the second press roller and the first conductive roller are configured to be equipotential;
• wherein the conductive plating apparatus is arranged outside the first plating tank and the second plating tank;
• and
• wherein the first plating tank being located at a side of the first conductive structure away from the second conductive structure, and the second plating tank being located at a side of the second conductive structure away from the first conductive structure,
• optionally, the first plating tank is in communication with the second plating tank,
• the plating system further comprises:
• a first separation structure for separating the first plating tank from a conductive liquid tank configured to contain conductive liquid, and a second separation structure for separating the second plating tank from the conductive liquid tank,
• wherein the first separation structure comprises a first liquid separation tank and a second liquid separation tank that are both located between the first plating tank and the conductive liquid tank, the first liquid separation tank being close to the first plating tank:
• and
• wherein the second separation structure comprises a third liquid separation tank and a fourth liquid separation tank that are both located between the second plating tank and the conductive liquid tank, the fourth liquid separation tank being close to the second plating tank.