C22C 9/10
Alloys based on copper: with silicon as the next major constituent
Official title: with silicon as the next major constituent
C22C9/10 (Alloys based on copper: with silicon as the next major constituent) appears on 83 US grants and 123 published applications in this corpus.
Search patents in C22C- Granted patents
- 83
- Published applications
- 123
- Assignees
- 71
- Inventors
- 270
- Latest grant
- 9 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 0 | 3 |
| 2005 | 3 | 2 |
| 2006 | 1 | 2 |
| 2007 | 1 | 4 |
| 2008 | 1 | 3 |
| 2009 | 0 | 4 |
| 2010 | 1 | 5 |
| 2011 | 0 | 7 |
| 2012 | 4 | 5 |
| 2013 | 2 | 13 |
| 2014 | 3 | 9 |
| 2015 | 3 | 5 |
| 2016 | 12 | 5 |
| 2017 | 1 | 10 |
| 2018 | 5 | 9 |
| 2019 | 10 | 8 |
| 2020 | 6 | 9 |
| 2021 | 10 | 4 |
| 2022 | 8 | 6 |
| 2023 | 3 | 2 |
| 2024 | 2 | 2 |
| 2025 | 2 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for preparing high-purity powder material, application thereof, and double-phase powder material9 Sep 2025US 12,409,494 B2
- Negative electrode active material, negative electrode, and battery14 Jan 2025US 12,199,277 B2Nippon Steel Corporation
- Surface treatment method for copper or copper alloy, surface treatment liquid for sterilizing copper or copper alloy, and sterilization method using copper or copper alloy treated by said method27 Aug 2024US 12,071,693 B2National Institute for Materials Science
- Laminate, sliding member, and method for manufacturing laminate12 Mar 2024US 11,926,900 B2Fukuda Metal Foil & Powder Co., Ltd.
- Free-cutting copper alloy and method for producing free-cutting copper alloy14 Nov 2023US 11,814,712 B2Mitsubishi Materials Corporation
- Copper Bonding Wire, Method for Manufacturing Copper Bonding Wire, and Semiconductor Device30 Jul 2026US 2026/0216830 A1TANAKA ELECTRONICS Co., Ltd.
- Brazed lap joint, method for manufacturing brazed lap joint, and vehicle component23 Apr 2026US 2026/0108964 A1Nippon Steel Corporation
- Copper alloy powder for metal am and method for manufacturing additive manufacturing product14 Aug 2025US 2025/0256330 A1Mitsubishi Materials Corporation
- Lead-free free-cutting beryllium copper alloy8 Aug 2024US 2024/0263277 A1NGK Insulators, Ltd.
- Method for preparing high-purity powder material, application thereof, and double-phase powder material1 Feb 2024US 2024/0033822 A1
Most cited
By later US patents
- Dispersion strengthened copper-base alloy for overlay32US 5,004,581 AToyota Jidosha Kabushiki Kaisha · 1991
- Materials for near field transducers and near field transducers containing same18US 9,286,931 B2Seagate Technology LLC · 2016
- Materials for near field transducers, near field tranducers containing same, and methods of forming18US 9,502,070 B2Seagate Technology LLC · 2016
- Materials for near field transducers and near field transducers containing same10US 9,281,002 B2Seagate Technology LLC · 2016
- Method of producing tungsten and tungsten carbide powder9US 4,402,737 AGTE Products Corporation · 1983