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US 2024/0263277 A1Published application
Lead-free free-cutting beryllium copper alloy
AssigneeNGK Insulators, Ltd.
InventorsHiromitsu UCHIYAMA, Koki CHIBA
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Abstract
There is provided a lead-free free-cutting beryllium copper alloy consisting of from 1.80% to 2.10% by weight of Be, from 0.10% to 3.00% by weight of Si, from 0.20% to 0.40% by weight of Co, from 0% to 0.10% by weight of Fe, from 0% to 0.10% by weight of Ni, and the balance being Cu and inevitable impurities, wherein the beryllium copper alloy includes a matrix phase being an α phase, a Si-rich phase being a κ phase rich in Si, and Co—Be—Si intermetallic compound grains containing Co, Be, and Si, and optionally Fe and/or Ni.
Claims6
A lead-free free-cutting beryllium copper alloy, consisting of:
- from 1.80% to 2.10% by weight of Be;
- from 0.10% to 3.00% by weight of Si;
- from 0.20% to 0.40% by weight of Co;
- from 0% to 0.10% by weight of Fe;
- from 0% to 0.10% by weight of Ni;
- and
- the balance being Cu and inevitable impurities,
- wherein the beryllium copper alloy has:
- a matrix phase being an α phase,
- a Si-rich phase being a κ phase rich in Si, and
- Co—Be—Si intermetallic compound grains containing Co, Be, and Si, and optionally Fe and/or Ni.
8 more elements
Dependencies are inferred from the claim text.