C22C 9/05
Alloys based on copper: with manganese as the next major constituent
Official title: with manganese as the next major constituent
C22C9/05 (Alloys based on copper: with manganese as the next major constituent) appears on 125 US grants and 179 published applications in this corpus.
Search patents in C22C- Granted patents
- 125
- Published applications
- 179
- Assignees
- 97
- Inventors
- 380
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 4 |
| 2003 | 1 | 5 |
| 2004 | 1 | 2 |
| 2005 | 4 | 3 |
| 2006 | 0 | 3 |
| 2007 | 0 | 2 |
| 2008 | 2 | 6 |
| 2009 | 2 | 5 |
| 2010 | 2 | 8 |
| 2011 | 2 | 4 |
| 2012 | 5 | 5 |
| 2013 | 2 | 13 |
| 2014 | 1 | 21 |
| 2015 | 10 | 9 |
| 2016 | 9 | 17 |
| 2017 | 6 | 13 |
| 2018 | 8 | 6 |
| 2019 | 14 | 16 |
| 2020 | 7 | 11 |
| 2021 | 10 | 4 |
| 2022 | 2 | 4 |
| 2023 | 4 | 6 |
| 2024 | 3 | 5 |
| 2025 | 6 | 2 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Alloy for resistor and use of resistor alloy in resistor28 Oct 2025US 12,454,740 B2Koa Corporation
- Resistance alloy for use in shunt resistor, use of resistance alloy in shunt resistor, and shunt resistor using resistance alloy7 Oct 2025US 12,435,391 B2Koa Corporation
- Resistance alloy for use in shunt resistor, use of resistance alloy in shunt resistor, and shunt resistor using resistance alloy7 Oct 2025US 12,437,904 B2Koa Corporation
- Copper alloys22 Jul 2025US 12,365,963 B2Advanced Alloy Holdings Pty Ltd
- Hardfaced products for abrasive applications and processes for making the same24 Jun 2025US 12,337,584 B2Esco Group LLC
- Infiltrated components8 Oct 2026US 2026/0308731 A1Oerlikon Metco (US) Inc.
- Brazed lap joint, method for manufacturing brazed lap joint, and vehicle component23 Apr 2026US 2026/0108964 A1Nippon Steel Corporation
- Porous metal structure and preparation method for the same15 Jan 2026US 2026/0015694 A1Contemporary Amperex Technology Co., Limited
- Porous metal structure and method for preparing same15 Jan 2026US 2026/0015703 A1Contemporary Amperex Technology Co., Limited
- Rapid solidified ductile cu-al-mn ribbon for elastocaloric applications4 Dec 2025US 2025/0369076 A1Iowa State University Research Foundation, Inc.
Most cited
By later US patents
- Copper alloys and liquid-crystal display device38US 7,626,665 B2Advanced Interconnect Materials, LLC · 2009
- High entropy alloy having composite microstructure32US 10,570,491 B2The Industry & Academic Cooperation in Chungnam National University (IAC) · 2020
- Copper alloy having high resistance to oxidation for use in leads on semiconductor devices21US 4,632,806 AFujitsu Limited · 1986
- Cu alloy film for display device and display device19US 9,305,470 B2Kobe Steel, Ltd. · 2016
- Materials for near field transducers and near field transducers containing same18US 9,286,931 B2Seagate Technology LLC · 2016