Copper alloy having high resistance to oxidation for use in leads on semiconductor devices
AssigneesMitsubishi Kinzoku Kabushiki Kaisha, Fujitsu Limited
InventorsMasaki Morikawa, Hideaki Yoshida, Kunio Kishida
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Abstract
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices is disclosed. The alloy consists essentially of 7-15 wt % Mn, 10-30 wt % Zn, 0.2-10 wt % Ni, 0.1-3 wt % Al, with the balance being Cu and incidental impurities. Also disclosed is a Cu alloy clad material wherein the substrate is made of Cu or Cu alloy having high electrical conductivity and good heat dissipation, and the cladding or partial cladding is composed of the Cu alloy having the composition specified above.
Claims2
A Cu alloy having high resistance to oxidation for use in leads on semiconductor devices, which consists essentially of 7-15% Mn, 10-25.5% Zn, 0.2-10% Ni, 0.1-3% Al, 0.2-3% of Sn, the percentage being by weight, with the balance being Cu and incidental impurities.
Dependencies are inferred from the claim text.