C22B 25/08
Refining
C22B25/08 (Refining) appears on 27 US grants and 26 published applications in this corpus.
Search patents in C22B- Granted patents
- 27
- Published applications
- 26
- Assignees
- 18
- Inventors
- 75
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 2 | 3 |
| 2010 | 0 | 3 |
| 2011 | 1 | 2 |
| 2012 | 3 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 0 |
| 2016 | 2 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 2 | 2 |
| 2020 | 0 | 2 |
| 2021 | 2 | 0 |
| 2022 | 1 | 2 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Printed wiring board, printed circuit board, and electronic component19 Aug 2025US 12,392,015 B2Ishikawa Technology Laboratory Co., Ltd.
- Device and method for efficiently separating ethyl tin from molten tin12 Aug 2025US 12,385,109 B2Yunnan Tin Co. Ltd. Tin Branch
- Co-production of lead and tin products13 Aug 2024US 12,060,626 B2Metallo Belgium
- Metal and tin alloy having low alpha-ray emission, and method for producing same4 Jun 2024US 12,000,020 B2Mitsubishi Materials Corporation
- Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member31 Oct 2023US 11,802,322 B2Ishikawa Technology Laboratory Co., Ltd.
- Printed wiring board, printed circuit board, and electronic component4 Jan 2024US 2024/0002979 A1Ishikawa Technology Laboratory Co., Ltd.
- Device and method for efficiently separating ethyl tin from molten tin6 Apr 2023US 2023/0104576 A1Yunnan Tin Co. Ltd. Tin Branch
- Metal and tin alloy having low alpha-ray emission, and method for producing same23 Mar 2023US 2023/0085708 A1Mitsubishi Materials Corporation
- Improved co-production of lead and tin products3 Mar 2022US 2022/0064760 A1Metallo Belgium
- Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member27 Jan 2022US 2022/0025484 A1Ishikawa Technology Laboratory Co., Ltd.
Most cited
By later US patents
- Process for refining molten metal11US 4,047,938 AUnion Carbide Corporation · 1977
- Method for separating solder and solder oxides10US 6,235,208 B1Matsushita Electric Industrial Co., Ltd. · 2001
- Apparatus for suspension smelting of finely-grained oxide and/or sulfide ores and concentrates8US 4,088,310 AOutokumpu Oy · 1978
- Apparatus for continuous vacuum-refining of metals5US 3,948,495 A1976
- Soldering apparatus and agent for separating solder and solder oxides5US 6,214,218 B1Matsushita Electric Industrial Co., Ltd. · 2001