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US 12,392,015 B2Granted
Printed wiring board, printed circuit board, and electronic component
AssigneesIshikawa Technology Laboratory Co., Ltd., Kayaba Office Co., Ltd., Akira Ogihara
InventorsHisao Ishikawa, Masao Kayaba, Akira Ogihara
Life of this patent
Estimating the term…
Abstract
A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.
Claims3
A printed wiring board comprising:
- a substrate;
- a wiring pattern layer formed in a thin-film shape on the substrate, the wiring pattern layer constituting a wiring pattern;
- and
- a solder layer formed in a thin-film shape on the wiring pattern layer, the solder layer containing a solder, wherein
- the solder in the solder layer is manufactured by a method comprising:
- a heating step of heating and melting a raw material to obtain a molten metal, the raw material containing tin as a main component, a metal element other than lead as a secondary component, and a carboxylic acid having 10 to 20 carbons;
- a removing step of removing, from the molten metal set to a pre-filtration temperature from 230° C. to 260° C., solids having a diameter of more than 10 μm and present within the molten metal by filtering the solids with a filter having an aperture size of not more than 10 μm, wherein the filter is heated by a heater, and a post-filtration temperature of the filtered molten metal is 230° C. to 260° C.;
- and
- a cooling step of cooling and solidifying the molten metal with the solids removed therefrom and depositing the carboxylic acid at a surface of the solder product to form a surface layer.
6 more elements
A printed circuit board comprising:
- a substrate;
- and
- an electronic component soldered onto the substrate by a solder product, wherein
- the solder product is manufactured by a method comprising:
- a heating step of heating and melting a raw material to obtain a molten metal, the raw material containing tin as a main component, a metal element other than lead as a secondary component, and a carboxylic acid having 10 to 20 carbons;
- a removing step of removing, from the molten metal set to a pre-filtration temperature from 230° C. to 260° C., solids having a diameter of more than 10 μm and present within the molten metal by filtering the solids with a filter having an aperture size of not more than 10 μm, wherein the filter is heated by a heater, and a post-filtration temperature of the filtered molten metal is 230° C. to 260° C.;
- and
- a cooling step of cooling and solidifying the molten metal with the solids removed therefrom and depositing the carboxylic acid at a surface of the solder product to form a surface layer.
5 more elements
An electronic component including a terminal, wherein
- a surface of the terminal is covered with a solder product manufactured by a method comprising:
- a heating step of heating and melting a raw material to obtain a molten metal, the raw material containing tin as a main component, a metal element other than lead as a secondary component, and a carboxylic acid having 10 to 20 carbons;
- a removing step of removing, from the molten metal set to a pre-filtration temperature from 230° C. to 260° C., solids having a diameter of more than 10 μm and present within the molten metal by filtering the solids with a filter having an aperture size of not more than 10 μm, wherein the filter is heated by a heater, and a post-filtration temperature of the filtered molten metal is 230° C. to 260° C.;
- and
- a cooling step of cooling and solidifying the molten metal with the solids removed therefrom and depositing the carboxylic acid at a surface of the solder product to form a surface layer.
2 more elements
Dependencies are inferred from the claim text.