C09K 5/14
Solid materials
Official title: Solid materials, e.g. powdery or granular
C09K5/14 (Solid materials) appears on 966 US grants and 1,752 published applications in this corpus.
Search patents in C09K- Granted patents
- 966
- Published applications
- 1,752
- Assignees
- 712
- Inventors
- 3,707
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 1 |
| 2002 | 7 | 9 |
| 2003 | 5 | 5 |
| 2004 | 3 | 8 |
| 2005 | 6 | 11 |
| 2006 | 2 | 3 |
| 2007 | 5 | 16 |
| 2008 | 3 | 11 |
| 2009 | 5 | 13 |
| 2010 | 5 | 20 |
| 2011 | 11 | 36 |
| 2012 | 4 | 44 |
| 2013 | 13 | 34 |
| 2014 | 20 | 62 |
| 2015 | 22 | 123 |
| 2016 | 59 | 108 |
| 2017 | 74 | 142 |
| 2018 | 98 | 133 |
| 2019 | 93 | 124 |
| 2020 | 97 | 125 |
| 2021 | 63 | 121 |
| 2022 | 73 | 129 |
| 2023 | 75 | 137 |
| 2024 | 63 | 135 |
| 2025 | 75 | 107 |
| 2026 | 69 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polymer and thermal interface material6 Oct 2026US 12,753,335 B2Industrial Technology Research Institute
- Heat exchanger6 Oct 2026US 12,753,336 B2Daikin Industries, Ltd.
- Method of encapsulating a phase change material6 Oct 2026US 12,753,601 B2UT-Battelle, LLC
- Granulated particle for cold storage material particle, cold storage material particle, cold storage device, refrigerator, cryopump superconducting magnet, nuclear magnetic resonance imaging apparatus, nuclear magnetic resonance apparatus, magnetic field application type single crystal pulling apparatus, and helium re-condensing device29 Sep 2026US 12,747,380 B2Niterra Materials Co., Ltd.
- Composition, thermally conductive material, thermally conductive sheet, and device with thermally conductive layer22 Sep 2026US 12,742,110 B2FUJIFILM Corporation
- Thermally conductive member, thermally conductive composition, structure, and method for reworking structure8 Oct 2026US 2026/0308435 A1Sekisui Chemical Co., Ltd.
- Silicone composition8 Oct 2026US 2026/0308438 A1Shin-Etsu Chemical Co., Ltd.
- Thermally conductive silicone composition and production method therefor1 Oct 2026US 2026/0297411 A1Shin-Etsu Chemical Co., Ltd.
- Graphene heat transfer1 Oct 2026US 2026/0298562 A1Graphene Manufacturing Group LTD
- Hexagonal boron nitride powder and method for producing same24 Sep 2026US 2026/0285682 A1Tokuyama Corporation
Most cited
By later US patents
- Devices using a medium having a high heat transfer rate103US 7,220,365 B2New Qu Energy Ltd. · 2007
- High dielectric strength thermal interface material71US 6,096,414 AParker-Hannifin Corporation · 2000
- Grout fluids for use in a geothermal well loop71US 9,845,423 B2Halliburton Energy Services.Inc. · 2017
- Method to form a conductive device64US 7,644,488 B2Integral Technologies, Inc. · 2010
- Thermally conductive molded article and method of making the same59US 7,264,869 B2Polymatech Co., Ltd. · 2007