Thermally conductive member, thermally conductive composition, structure, and method for reworking structure
AssigneesSekisui Chemical Co., Ltd., Sekisui Polymatech Co., Ltd.
InventorsToshiki KANEKO, Kensho MIYAMOTO
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Abstract
Disclosed herein is a thermally conductive member containing a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler, wherein when the thermally conductive member is sandwiched between glass cloth films, compressed by 10%, and left to stand at 90° C. for 40 hours, a weight loss ratio B of the thermally conductive member is 0.05% or more and 3.0% or less.
Claims15
A thermally conductive member comprising a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler,
- in a case of the thermally conductive member being sandwiched between glass cloth films, compressed by 10%, and left to stand at 90° C. for 40 hours, a weight loss ratio B of the thermally conductive member being 0.05% or more and 3.0% or less.
A structure comprising a heating element, a heat-dissipating element, and a thermally conductive member that bonds the heating element and the heat-dissipating element together,
- the thermally conductive member comprising a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler, and
- in a case of the thermally conductive member being cut to have a size of 20 mm×20 mm and a thickness of 2 mm, sandwiched between glass cloth films, compressed by 10%, and left to stand at 90° C. for 40 hours, a weight loss ratio B of the thermally conductive member being 0.05% or more and 3.0% or less.
A structure comprising a heating element, a heat-dissipating element, and a thermally conductive member that bonds the heating element and the heat-dissipating element together,
- the thermally conductive member comprising a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler,
- an adhesive force between the heating element and the heat-dissipating element at 25° C. being 0.05 MPa or more and 2.0 MPa or less, and
- a post-heating adhesive force between the heating element and the heat-dissipating element at 90° C. being less than the adhesive force and equal to or less than 0.2 MPa.
A thermally conductive composition comprising a liquid polymer being a precursor of a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler,
- in a case of a cured product of the thermally conductive composition being sandwiched between glass cloth films, compressed by 10%, and left to stand at 90° C. for 40 hours, a weight loss ratio B of the cured product of the thermally conductive composition being 0.05% or more and 3.0% or less.
A method for reworking a structure comprising a heating element, a heat-dissipating element, and a thermally conductive member disposed between the heating element and the heat-dissipating element,
- the thermally conductive member comprises a polymer matrix, a phase change material having a melting point of higher than 25° C. and 120° C. or lower, and a thermally conductive filler,
- the method comprising heating the structure to a temperature equal to or higher than the melting point of the phase change material and then separating the heating element and the heat-dissipating element from each other.
Dependencies are inferred from the claim text.