C09J 4/00
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon
Official title: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16}
C09J4/00 (Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon) appears on 2,137 US grants and 2,167 published applications in this corpus.
Search patents in C09J- Granted patents
- 2,137
- Published applications
- 2,167
- Assignees
- 768
- Inventors
- 5,007
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 26 | 0 |
| 1978 | 28 | 0 |
| 1979 | 22 | 0 |
| 1980 | 16 | 0 |
| 1981 | 25 | 0 |
| 1982 | 31 | 0 |
| 1983 | 37 | 0 |
| 1984 | 41 | 0 |
| 1985 | 44 | 0 |
| 1986 | 39 | 0 |
| 1987 | 36 | 0 |
| 1988 | 27 | 0 |
| 1989 | 21 | 0 |
| 1990 | 27 | 0 |
| 1991 | 25 | 0 |
| 1992 | 31 | 0 |
| 1993 | 23 | 0 |
| 1994 | 37 | 0 |
| 1995 | 29 | 0 |
| 1996 | 26 | 0 |
| 1997 | 32 | 0 |
| 1998 | 41 | 0 |
| 1999 | 38 | 0 |
| 2000 | 34 | 0 |
| 2001 | 43 | 12 |
| 2002 | 43 | 39 |
| 2003 | 49 | 50 |
| 2004 | 44 | 43 |
| 2005 | 25 | 53 |
| 2006 | 21 | 31 |
| 2007 | 18 | 39 |
| 2008 | 15 | 39 |
| 2009 | 15 | 41 |
| 2010 | 24 | 57 |
| 2011 | 27 | 45 |
| 2012 | 41 | 59 |
| 2013 | 30 | 69 |
| 2014 | 30 | 90 |
| 2015 | 48 | 117 |
| 2016 | 57 | 153 |
| 2017 | 104 | 156 |
| 2018 | 100 | 120 |
| 2019 | 93 | 127 |
| 2020 | 103 | 135 |
| 2021 | 90 | 114 |
| 2022 | 75 | 136 |
| 2023 | 67 | 106 |
| 2024 | 87 | 133 |
| 2025 | 69 | 118 |
| 2026 | 55 | 85 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Adhesive composition, adhesive film prepared from the same and display member including the same6 Oct 2026US 12,753,329 B2Samsung Electronics Co., Ltd.
- Resin composition, adhesive member, and display device including the adhesive member29 Sep 2026US 12,747,372 B2Samsung Display Co., Ltd.
- Adhesive composition, adhesive film prepared from the same and display member including the same29 Sep 2026US 12,747,374 B2Samsung Electronics Co., Ltd.
- Photocurable pressure-sensitive adhesive composition for electrical components with three-dimensional structure22 Sep 2026US 12,742,101 B2Hyundai Mobis Co., Ltd.
- Thermosetting composition, cured product, device, and method for manufacturing the device11 Aug 2026US 12,703,814 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, adhesive member, and electronic apparatus including the adhesive member8 Oct 2026US 2026/0308420 A1Samsung Display Co., Ltd.
- Adhesive sheet8 Oct 2026US 2026/0308423 A1Samsung SDI.Co., Ltd.
- Resin composition, adhesive member, and electronic apparatus including the adhesive member8 Oct 2026US 2026/0308427 A1Samsung Display Co., Ltd.
- Adhesive composition and bonded object1 Oct 2026US 2026/0297385 A1Resonac Corporation
- Electrically conductive resin adhesive agent and cured product thereof1 Oct 2026US 2026/0297397 A1Threebond Co., Ltd.
Most cited
By later US patents
- Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing421US 4,181,752 AMinnesota Mining and Manufacturing Company · 1980
- Low surface energy liner of perfluoropolyether251US 4,472,480 AMinnesota Mining and Manufacturing Company · 1984
- Semiconductor flip-chip package and method for the fabrication thereof227US 6,335,571 B12002
- pH-modified biocompatible monomer and polymer compositions220US 6,143,352 AClosure Medical Corporation · 2000
- Methods of making packaged viscoelastic compositions211US 5,804,610 AMinnesota Mining and Manufacturing Company · 1998